Giovanbattista Mattiussi, Product Marketing and Dr. Diogo Varajao, Senior System Application Engineer, Infineon Technologies
The global trends - such as digitalization and energy efficiency - that have emerged and accelerated in the past few years pose new challenges to the manufacturers as well as the semiconductor market. Developing power semiconductor devices that contribute to highly efficient power management systems is on the ag
Figure 1: Southampton hands. Across each palm can be seen a dc motor with a worm and wheel to rotate the thumb. Five other motors flex and extend the fingers and thumb. The fingertips have touch (force), slip/texture, and temperature sensors.
Dr. Arthur Chiang, Director of Reliability Engineering, Vishay Siliconix
Though copper wire bonding developed nearly 30 years ago, it has only recently gained in popularity due to the rapid increase in the price of gold, which is now about 7,000 times that of copper (Reference