Technical Features

November 2023

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Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef

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Date:

08/31/2026

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Figure 1: Some battery chemistries compared

An Integrated Solution to Li-ion Battery Management

John Carpenter, Product Development Manager, Qorvo

This article discusses the issue and describes cost-effective integrated solutions that can also add extra user benefits, including state-of-charge and state-of-health monitoring. Going back in history, perhaps hundreds of chemistries have been proposed for batteries. These have ranged from the original copper,

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Date:

11/30/2023

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Figure 1: Footprint comparison: EiceDRIVER 2EDN7534U in TSNP vs SMD resistors

Smallest Dual-Channel Low-Side Gate Driver ICs

Antonello Laneve, Staff System Application Engineer, Walter Balzarotti, Principal Product Application Engineer, and Dr. Diogo Varajao, Head of Technical Marketing of Isolation ICs, Infineon Technologies

Overall power levels have been going up in Datacenter and Computing to supply the GPUs and CPUs used in emerging applications such as Artificial Intelligence, Computer Vision, and Machine Learning. Consequently, ever-increasing power density and efficiency requirements require innovation, not only on power switch te

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Date:

11/01/2023

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Figure 1: Multiple applications can benefit from the features of SiC devices

Matching the Supply and Demand for Next-Gen SiC Devices

Ajay Sattu, onsemi

Components based on wide-bandgap (WBG) technologies such as SiC are crucial to improve efficiency in industrial, automotive and renewable energy applications. In this article, onsemi considers how next-generation SiC devices will evolve to enable even higher efficiency and smaller form factors and also discusses wh

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Date:

11/01/2023

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Figure 1: These technologies all have their strengths and application areas in which they fit the best.

Silicon Carbide Enables PFC Evolution

Eric Schulte, Product Marketing Manager, Wolfspeed

The move to electric drive by the automotive industry has recently driven growth in SiC use as well as in design engineer attention toward the benefits of the technology in wider application areas. Selecting a device technology No matter what the application, every power supply desi

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Date:

11/01/2023

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Table 1: 80 PLUS efficiency specifications at 230V input

A New Generation of GaN Devices to Meet AI Server Power Demands

Tao Wei, Sr. Applications Manager, Navitas Semiconductor

The rapid development and deployment of massive artificial intelligence (AI) in the cloud - including OpenAI’s ChatGPT, Microsoft’s Bing with AI, plus Google’s Bard and Deep Mind Gemini - is drawing new and more powerful, purpose-designed AI processors into data center servers. Next-generation hyperscale sy

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Date:

11/01/2023

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Figure 1: Thermal infrared image of a PCB showing significant heat sources. (Source: Teledyne Flir)

A Guide to the Fundamentals of Thermal Management

Mark Patrick, Mouser Electronics

Electronic components like to run cool. Any part that exhibits an internal self-heating effect will reduce its reliability and those of others around it. The heat generated may also cause long-term warping of the PCB, potentially decreasing the integrity of connections to other components and impacting trace im

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Date:

11/01/2023

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Figure 1. IO-Link Wireless System Topology

How IO-Link Wireless is enabling Industry 4.0

Roland Gémesi, Senior Systems Engineer & Kiruba Subramani, Senior Systems Engineer, Silicon Labs, Ofer Blonskey, Chief Technology Officer, CoreTigo

A key enabler on Industry 4.0 is effective machine connectivity, including in places that were not possible before, for more intelligent devices at the edge. For industrial applications, the traditional solution is wired communication, which provides high reliability and low latency. However, cables limit the

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Date:

11/01/2023

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Figure 1: Microchip CIPs shown above are color-coded by peripheral category. The green items provide additional power reduction possibilities

Five Ways Modern 8-bit Microcontrollers Evolved to Solve the Latest IoT System Challenges

Joshua Bowen, Product Marketing Engineer, 8-bit MCU business unit, Microchip Technology

It’s been over 50 years since the development of the first microcontroller. As these systems became more complex, many subsystems now require hundreds of thousands— if not millions—of MCUs. This puts a premium on delivering low-cost devices with high reliability and durability. With the advent of th

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Date:

11/01/2023

Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

Aug 31,2026

Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

Silicon Carbide Semiconductors: Gaining Widespread Adoption

Jul 30,2026

Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

Innovation through Lean AI

Jun 1,2026

Crystal Chen, Product Marketing & Product Management, Infineon HiRel

Molded Power Inductors

May 29,2026

Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

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Technical Features

Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

Silicon Carbide Semiconductors: Gaining Widespread Adoption

Innovation through Lean AI

Molded Power Inductors

Power Systems Design

Power Systems Design

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