Technical Features

November 2023
QSPICE: A Mission to Get SPICE Right

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Figure 1: MOSFET channel punch-through showing outputs from previous SPICE simulators vs. QSPICE

Qorvo’s QSPICE™ simulator for analog and mixed-signal simulation provides power designers with the tools to confidently evaluate their designs. Free to use, QSPICE improves SPICE basics, supports large amounts of digital logic without performance penalties, and delivers the speed and accuracy needed for rel
Date:
11/29/2024
An Integrated Solution to Li-ion Battery Management

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Figure 1: Some battery chemistries compared

This article discusses the issue and describes cost-effective integrated solutions that can also add extra user benefits, including state-of-charge and state-of-health monitoring. Going back in history, perhaps hundreds of chemistries have been proposed for batteries. These have ranged from the original copper,
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Date:
11/30/2023
Smallest Dual-Channel Low-Side Gate Driver ICs

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Figure 1: Footprint comparison: EiceDRIVER 2EDN7534U in TSNP vs SMD resistors

Overall power levels have been going up in Datacenter and Computing to supply the GPUs and CPUs used in emerging applications such as Artificial Intelligence, Computer Vision, and Machine Learning. Consequently, ever-increasing power density and efficiency requirements require innovation, not only on power switch te
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Date:
11/01/2023
Matching the Supply and Demand for Next-Gen SiC Devices

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Figure 1: Multiple applications can benefit from the features of SiC devices

Components based on wide-bandgap (WBG) technologies such as SiC are crucial to improve efficiency in industrial, automotive and renewable energy applications. In this article, onsemi considers how next-generation SiC devices will evolve to enable even higher efficiency and smaller form factors and also discusses wh
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Date:
11/01/2023
Silicon Carbide Enables PFC Evolution

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Figure 1: These technologies all have their strengths and application areas in which they fit the best.

The move to electric drive by the automotive industry has recently driven growth in SiC use as well as in design engineer attention toward the benefits of the technology in wider application areas.   Selecting a device technology  No matter what the application, every power supply desi
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Date:
11/01/2023
A New Generation of GaN Devices to Meet AI Server Power Demands

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Table 1: 80 PLUS efficiency specifications at 230V input

The rapid development and deployment of massive artificial intelligence (AI) in the cloud - including OpenAI’s ChatGPT, Microsoft’s Bing with AI, plus Google’s Bard and Deep Mind Gemini - is drawing new and more powerful, purpose-designed AI processors into data center servers. Next-generation hyperscale sy
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Date:
11/01/2023
A Guide to the Fundamentals of Thermal Management

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Figure 1: Thermal infrared image of a PCB showing significant heat sources. (Source: Teledyne Flir)

Electronic components like to run cool. Any part that exhibits an internal self-heating effect will reduce its reliability and those of others around it. The heat generated may also cause long-term warping of the PCB, potentially decreasing the integrity of connections to other components and impacting trace im
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Date:
11/01/2023
How IO-Link Wireless is enabling Industry 4.0

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Figure 1. IO-Link Wireless System Topology

A key enabler on Industry 4.0 is effective machine connectivity, including in places that were not possible before, for more intelligent devices at the edge. For industrial applications, the traditional solution is wired communication, which provides high reliability and low latency. However, cables limit the
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Date:
11/01/2023
Five Ways Modern 8-bit Microcontrollers Evolved to Solve the Latest IoT System Challenges

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Figure 1: Microchip CIPs shown above are color-coded by peripheral category. The green items provide additional power reduction possibilities

It’s been over 50 years since the development of the first microcontroller.  As these systems became more complex, many subsystems now require hundreds of thousands— if not millions—of MCUs. This puts a premium on delivering low-cost devices with high reliability and durability. With the advent of th
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Date:
11/01/2023
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