Technical Features
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Figure 1 Technology positioning – Si, SiC and GaN
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Figure 1: Supply lines - eliminate loops and decouple at local boundaries
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Figure 1: Structure of the SaberRD environment
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Table 1: Teseo-II Urban Canyon Performance
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Figure 1: The Die Free package resistances of different power semiconductor packages
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Figure 1: The new innovative body architecture allows a significant wire harness reduction in comparison to today's architecture
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Figure 1: Ballast-Igniter Circuit
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Figure 1: Typical positioning of high-voltage vehicle components
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Figure 1: Principle of Car Wiring Harness Pulse Immunity Test Using an ESD Simulator ("ESD Pulse Gun")
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Figure 1: Boost Buck Structure
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Figure 1: Typical LTC3859A Start/Stop Application Schematic
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Figure 1: Spectrum of a 250A DC charger used for testing G3-PLC operation
