Technical Features

    July 2015
    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

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    Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

    ­1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef
    Date:
    08/31/2026
    As automobiles continue to add an ever increasing number of electronic systems to enhance safety, comfort, efficiency and performance while minimizing harmful exhaust emissions, it comes as no surprise that they require physically smaller power solutions with dramatically higher power levels. Additionally, with th
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    Date:
    07/03/2015
    The automotive industry is under significant societal pressure to address global warming. Electric vehicles (EV) and hybrid electric vehicles (HEV) are expected to lead the way in CO2 reduction, relying on their internal inverter systems to control high electric power in the limited space available. Due to these sp
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    Date:
    07/03/2015
    For many years, engineers have used calculation tools to optimize a switch mode power supply design. In the early years, power supply engineers would program their own tools or use spreadsheets they generated themselves with the required formulas underlying a certain power supply topology. While this helped tr
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    Date:
    07/03/2015
    Tantalum surface mount capacitors with a solid electrolyte have been the favorite capacitor technology choice in many electronic devices for more than five decades, thanks to their stability, high reliability, and superior volumetric efficiency. The traditional manganese dioxide (MnO2) cathode material provides go
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    Date:
    07/03/2015
    Today’s power supply designers must strive to meet increasingly tough environmental legislation governing standby power and average efficiency. On the other hand, they must also ensure designs comply with relevant technical requirements. Wall adapters for charging smartphones, for example, must meet revi
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    Date:
    07/03/2015
    The variety of product labeling standards set forth, or under consideration, by organizations such as the Electronics Components Industry Association (ECIA), Electronics Components Association (ECA), Joint Electron Device Engineering Council (JDEC), Government Electronics and Information Technology Associa
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    Date:
    07/03/2015
    The EN54 specification applies to fire detection and fire alarm systems to ensure that these critical systems have a standardized list of requirements, testing and performance criteria. It is designed to streamline the specification and manufacturing processes, but the definition of component parts, in particular th
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    Date:
    07/03/2015
    Automotive manufacturers are increasingly incorporating higher-power, higher-inrush current applications – including anti-lock braking system (ABS) modules, glow plugs and engine cooling fans – into their latest-generation cars. A popular trend is to integrate multiple functionalities into one module, which in
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    Date:
    07/03/2015
    There’s a large element of irony in the design of today’s cars. They are increasingly energy efficient, yet they also have many more electrical demands being placed on them. These demands range from an array of safety-related functions to numerous in-cabin convenience, connectivity, and entertainment features, su
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    Date:
    07/03/2015
    The automotive powertrain semiconductor market grew 8.3 percent in 2014, with increasing volumes of new vehicles and the need for fuel-efficient vehicle technologies the main drivers contributing to it. IHS forecasts that revenues related to powertrain semiconductors will increase with a compound annual growth ra
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    Date:
    07/03/2015
    Archive

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

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    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

    Innovation through Lean AI

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    Crystal Chen, Product Marketing & Product Management, Infineon HiRel

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

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