Technical Features

August 2019
Electromagnetic Compatibility

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Figure 1: PSE (board in the picture below) and PD (board in the picture above) of the Reference Design RD041 during start-up

­With just one twisted pair of wires, Single-Pair Ethernet is a convincingly lean solution. This cabling becomes even more efficient if it is also used for power supply in addition to data transmission - this is referred to as "Single-Pair with Power-over-Ethernet" (SPoE). What about electromagnetic compatibili
Date:
09/30/2025
The Road to Success for Power Semiconductors

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Figure 1: Comparison of Superjunction transistor, SiC MOSFET, and GaN HEMT

The commercial availability of Superjunction transistors 20 years ago, challenged and finally proved wrong the limitations of conventional silicon-based transistors with respect to on-state resistance. What was regarded as revolutionary at that time is standard today. Today there is not a single transistor from 25
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Date:
08/31/2019
Are you SiC of Silicon? – Part 5

Anup Bhalla, Vice President Engineering, UnitedSiC

Ultra-High Voltage SiC and Supercascodes New applications are emerging that require high voltage switch technology which is significantly lower in balance-of-system costs and operating losses than silicon IGBT and IGCT technology. This spans a wide range from solid state transformers, MW motor drives, to smart
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Date:
08/20/2019
A Charging Infrastructure for Wide-Scale EV Adoption

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Figure 1: EV Charging Station

A Charging Infrastructure for Wide-Scale EV Adoption To ensure that electric vehicles (EVs) have the same freedom to roam as today’s fossil-fuel cars, infrastructure challenges need to be addressed   By: Alessandro Mastellari, Technical Specialist, Avnet Abacus   Concerns abo
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Date:
08/10/2019
Timing is Everything

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Microchip CSA 100 MEMs oscillator

Timing is Everything MEMS technology is well-suited to meet the demands of these emerging automotive applications By: Microchip Technologies Automotive-grade MEMS oscillators meet complex demands of emerging automotive applications by offering robust performance and tolerance to harsh environments.
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Date:
08/10/2019
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