Technical Features

September 2012
Effective USB 3.1 Filtering and Protection

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Figure 1: USB-C dongle used to demonstrate USB 3.1 filtering and protection

The USB connector and standard are one of the most widely implemented and successful interfaces ever used. The applications are commercial and industrial, and both have been pushing the standard to be faster. The USB standard has been updated to version 3.1. This standard increases data transfer speeds to 5
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Date:
07/23/2019
Integrated Current Sensing
Competitive markets put pressure on OEMs to improve energy efficiency in their product designs. Accordingly, it is important to be able to monitor accurately currents through critical paths
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Date:
09/21/2012
How high-TJ TRIACs benefit your applications

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Figure 1a: Two TRIACs operating near their Tj(max): The BTB16-600CW standard TRIAC (a) and the T1635H-6T high-temperature TRIAC (b).

High-temperature TRIACs present several benefits particularly useful in applications demanding high current density or imposing high-temperature environments. These applications include
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Date:
09/12/2012
Performance vs power in off-chip DDR SDRAM

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Figure 1: Relative active power

To deliver new features and higher performance in consumer-electronic products, SoC developers constantly look to integrate more functionality into their designs. SoCs with more features
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Date:
09/12/2012

Test today your PV inverter for tomorrow

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Figure 1: Micro-inverters convert direct current from individual solar panels into alternating current for the electric grid.

An increasing number of DERs (distributed energy resources), which include storage systems, are connecting to the grid by means of inverters. This is already evident in countries with dedicated
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Date:
09/10/2012
IEC 61850 increases grid reliability

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Figure 1: Redundant 8.46 kV lines power an industrial customer's facility.

A power industry consultant recently asked for assistance solving a reliability problem for a municipal utility. The utility had recently experienced disturbances on its system, negatively
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Date:
09/10/2012
Securing the life cycle in the smart grid

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Figure 1: A conscientious life-cycle design will consider threats at every step of product development and manufacturing.

Investment in smart meters and smart-grid end equipment continues to grow worldwide as countries try to make their electric delivery systems more efficient. As critical as the electric delivery
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Date:
09/07/2012
Improving electric-motor testing techniques

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Figure 1: Each stage of embedded-software validation for electric-motor simulation introduces new challenges for test engineers such as high-speed processing and high-power signals.

The growing adoption of electric motors in the automotive industry creates new challenges for embedded-control-system developers and test engineers. Control algorithms for electric-drive
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Date:
09/05/2012
New power electronics based on GaN MISHEMPTs

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Figure 1: EpiGaN deposits a unique in-situ SiN capping layer, grown by MOCVD on top of HEMT epi wafers.

GaN appears to be a highly suitable material for power switching devices operating at high frequencies without suffering major losses. The Promise of GaN This is due to the drastically
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Date:
09/04/2012