Technical Features

    September 2012
    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

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    Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

    ­1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef
    Date:
    08/31/2026
    Integrated Current Sensing
    Competitive markets put pressure on OEMs to improve energy efficiency in their product designs. Accordingly, it is important to be able to monitor accurately currents through critical paths
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    Date:
    09/21/2012
    Performance vs power in off-chip DDR SDRAM

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    Figure 1: Relative active power

    To deliver new features and higher performance in consumer-electronic products, SoC developers constantly look to integrate more functionality into their designs. SoCs with more features
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    Date:
    09/12/2012
    How high-TJ TRIACs benefit your applications

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    Figure 1a: Two TRIACs operating near their Tj(max): The BTB16-600CW standard TRIAC (a) and the T1635H-6T high-temperature TRIAC (b).

    High-temperature TRIACs present several benefits particularly useful in applications demanding high current density or imposing high-temperature environments. These applications include
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    Date:
    09/12/2012
    IEC 61850 increases grid reliability

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    Figure 1: Redundant 8.46 kV lines power an industrial customer's facility.

    A power industry consultant recently asked for assistance solving a reliability problem for a municipal utility. The utility had recently experienced disturbances on its system, negatively
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    Date:
    09/10/2012
    Test today your PV inverter for tomorrow

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    Figure 1: Micro-inverters convert direct current from individual solar panels into alternating current for the electric grid.

    An increasing number of DERs (distributed energy resources), which include storage systems, are connecting to the grid by means of inverters. This is already evident in countries with dedicated
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    Date:
    09/10/2012
    Securing the life cycle in the smart grid

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    Figure 1: A conscientious life-cycle design will consider threats at every step of product development and manufacturing.

    Investment in smart meters and smart-grid end equipment continues to grow worldwide as countries try to make their electric delivery systems more efficient. As critical as the electric delivery
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    Date:
    09/07/2012
    Improving electric-motor testing techniques

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    Figure 1: Each stage of embedded-software validation for electric-motor simulation introduces new challenges for test engineers such as high-speed processing and high-power signals.

    The growing adoption of electric motors in the automotive industry creates new challenges for embedded-control-system developers and test engineers. Control algorithms for electric-drive
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    Date:
    09/05/2012
    New power electronics based on GaN MISHEMPTs

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    Figure 1: EpiGaN deposits a unique in-situ SiN capping layer, grown by MOCVD on top of HEMT epi wafers.

    GaN appears to be a highly suitable material for power switching devices operating at high frequencies without suffering major losses. The Promise of GaN This is due to the drastically
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    Date:
    09/04/2012
    Archive

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

    Silicon Carbide Semiconductors: Gaining Widespread Adoption

    Jul 30,2026
    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

    Innovation through Lean AI

    Jun 1,2026
    Crystal Chen, Product Marketing & Product Management, Infineon HiRel

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

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