Technical Features

September 2012
QSPICE: A Mission to Get SPICE Right

Click image to enlarge

Figure 1: MOSFET channel punch-through showing outputs from previous SPICE simulators vs. QSPICE

Qorvo’s QSPICE™ simulator for analog and mixed-signal simulation provides power designers with the tools to confidently evaluate their designs. Free to use, QSPICE improves SPICE basics, supports large amounts of digital logic without performance penalties, and delivers the speed and accuracy needed for rel
Date:
11/29/2024
Integrated Current Sensing
Competitive markets put pressure on OEMs to improve energy efficiency in their product designs. Accordingly, it is important to be able to monitor accurately currents through critical paths
. . . Learn More
Date:
09/21/2012
Performance vs power in off-chip DDR SDRAM

Click image to enlarge

Figure 1: Relative active power

To deliver new features and higher performance in consumer-electronic products, SoC developers constantly look to integrate more functionality into their designs. SoCs with more features
. . . Learn More
Date:
09/12/2012
How high-TJ TRIACs benefit your applications

Click image to enlarge

Figure 1a: Two TRIACs operating near their Tj(max): The BTB16-600CW standard TRIAC (a) and the T1635H-6T high-temperature TRIAC (b).

High-temperature TRIACs present several benefits particularly useful in applications demanding high current density or imposing high-temperature environments. These applications include
. . . Learn More
Date:
09/12/2012
IEC 61850 increases grid reliability

Click image to enlarge

Figure 1: Redundant 8.46 kV lines power an industrial customer's facility.

A power industry consultant recently asked for assistance solving a reliability problem for a municipal utility. The utility had recently experienced disturbances on its system, negatively
. . . Learn More
Date:
09/10/2012
Test today your PV inverter for tomorrow

Click image to enlarge

Figure 1: Micro-inverters convert direct current from individual solar panels into alternating current for the electric grid.

An increasing number of DERs (distributed energy resources), which include storage systems, are connecting to the grid by means of inverters. This is already evident in countries with dedicated
. . . Learn More
Date:
09/10/2012
Securing the life cycle in the smart grid

Click image to enlarge

Figure 1: A conscientious life-cycle design will consider threats at every step of product development and manufacturing.

Investment in smart meters and smart-grid end equipment continues to grow worldwide as countries try to make their electric delivery systems more efficient. As critical as the electric delivery
. . . Learn More
Date:
09/07/2012
Improving electric-motor testing techniques

Click image to enlarge

Figure 1: Each stage of embedded-software validation for electric-motor simulation introduces new challenges for test engineers such as high-speed processing and high-power signals.

The growing adoption of electric motors in the automotive industry creates new challenges for embedded-control-system developers and test engineers. Control algorithms for electric-drive
. . . Learn More
Date:
09/05/2012
New power electronics based on GaN MISHEMPTs

Click image to enlarge

Figure 1: EpiGaN deposits a unique in-situ SiN capping layer, grown by MOCVD on top of HEMT epi wafers.

GaN appears to be a highly suitable material for power switching devices operating at high frequencies without suffering major losses. The Promise of GaN This is due to the drastically
. . . Learn More
Date:
09/04/2012
Archives