Industrial

May 2024

Microchip Adds 12 Products to its Wireless Portfolio that Further Reduce Barriers to Bluetooth Integration for Designers at Every Skill Level

Microchip Adds 12 Products to its Wireless Portfolio that Further Reduce Barriers to Bluetooth Integration for Designers at Every Skill Level

Microchip Adds 12 Products to its Wireless Portfolio that Further Reduce Barriers to Bluetooth Integration for Designers at Every Skill Level

System designers face many barriers when adding Bluetooth® functionality to their products, from skill and resource limitations to budget constraints to time-to-market pressures to challenging performance and integration requirements. Microchip Technology has expanded its Bluetooth Low Energy portfolio wi

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Date:

05/30/2024

Power Relays Line Adds Over 300 New SKUs

Power Relays Line Adds Over 300 New SKUs

Power Relays Line Adds Over 300 New SKUs

CUI Devices’ Relays Group announced the expansion of its line of power relays with the addition of over 300 new SKUs. Ideal for high-level current switching in a range of industrial applications, measurement and control equipment, and safety systems, CUI Devices’ power relays offer ma

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Date:

05/29/2024

Qorvo Unveils Industry's Highest Gain Pre-Driver for 5G mMIMO

Qorvo Unveils Industry's Highest Gain Pre-Driver for 5G mMIMO

Qorvo Unveils Industry's Highest Gain Pre-Driver for 5G mMIMO

Qorvo announced the industry’s highest gain pre-driver providing 39dB gain at 3.5 GHz and achieving a peak power of +29dBm. This new massive MIMO (mMIMO) pre-driver demonstrates Qorvo's commitment to advancing 5G technology and further strengthens its position as a leader in cellular infrastructure. The QPA9822 is a wideband

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Date:

05/29/2024

Würth Elektronik Expands its Range of Power Inductors

Würth Elektronik Expands its Range of Power Inductors

Würth Elektronik Expands its Range of Power Inductors

In addition to Würth Elektronik’s five existing package sizes of WE-XHMI SMT power inductors there are now eight new packages. These compact yet extremely efficient inductors feature high current capacity up to 56 A saturation current and the ability to handle high transient current spikes. This ma

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Date:

05/28/2024

Infineon Unveils CoolSiC MOSFETs 400 V, Redefining Power Density and Efficiency in AI Server Power Supplies

Infineon’s launches the industry’s first CoolSiC™ 400 V MOSFETs, specially developed for use in the AC/DC stage of AI servers.

Infineon Unveils CoolSiC MOSFETs 400 V, Redefining Power Density and Efficiency in AI Server Power Supplies

With the increasing power requirements of Artificial Intelligence (AI) processors, server power supplies (PSUs) must deliver more and more power without exceeding the defined dimensions of the server racks. This is driven by a surge in energy demand of high-level GPUs, which could consume 2 kW and more per ch

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Date:

05/28/2024

Miniature Connector from Hirose Offers Blind-Mate Panel Mounting

Miniature Connector from Hirose Offers Blind-Mate Panel Mounting

Miniature Connector from Hirose Offers Blind-Mate Panel Mounting

Hirose has expanded its miniature connector offering to include a version with blind mating ability. Constructed with self-aligning elements, the HR34P Series panel mount connector guides itself into the correct mating position. Commonly used for rack-to-panel connectivity in base stations, industrial ma

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Date:

05/24/2024

Moxa USB-IF Certified Hubs Offer Seamless Compatibility Among Wider Range of Industrial Devices

Moxa USB-IF Certified Hubs Offer Seamless Compatibility Among Wider Range of Industrial Devices

Moxa USB-IF Certified Hubs Offer Seamless Compatibility Among Wider Range of Industrial Devices

Moxa Inc., a global leader in industrial communications and networks, is now offering the world’s first industrial USB Hubs certified by the USB Implementers Forum (USB-IF). With USB 3.2 Gen 1 SuperSpeed 5 Gbps data transmission rates through every port, the new UPort USB 3.2 Series hubs deliver ten times th

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Date:

05/24/2024

PX5 Brings Advanced Storage Solutions to Embedded Systems

PX5 Brings Advanced Storage Solutions to Embedded Systems

PX5 Brings Advanced Storage Solutions to Embedded Systems

PX5 announced the addition of the PX5 FILE FAT-compatible embedded file system. Developers can leverage PX5 FILE for real-time storage across any physical medium, e.g., RAM, FLASH, and SD cards. PX5 FILE supports the industry-standard FAT (File Allocation Table) file system format, enabling application data to

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Date:

05/21/2024

CUI Devices Introduces Memory Card Connectors Line to Connectors Portfolio

CUI Devices Introduces Memory Card Connectors Line to Connectors Portfolio

CUI Devices Introduces Memory Card Connectors Line to Connectors Portfolio

CUI Devices’ Interconnect Group announced the addition of memory card connectors to its connectors product portfolio. Available in a variety of SD and microSD card connectors as well as SIM, micro-SIM, nano-SIM, and smart card connector types, CUI Devices’ memory card connectors of

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Date:

05/17/2024

Good Vibrations: New Tech may Lead to Smaller, More Powerful Wireless Devices

Matt Eichenfield's team at Sandia National Laboratories uses multiple microwave frequencies to characterize a nonlinear phononic mixing device they built on a silicon wafer.

Good Vibrations: New Tech may Lead to Smaller, More Powerful Wireless Devices

UNIVERSITY OF ARIZONA

What if your earbuds could do everything your smartphone can do already, except better? What sounds a bit like science fiction may actually not be so far off. A new class of synthetic materials could herald the next revolution of wireless technologies, enabling devices to be smaller, require less signal strength an

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Date:

05/10/2024

Littelfuse Unveils IX4352NE Low-side Gate Driver for SiC MOSFETs and High-power IGBTs

IX4352NE Low-side Gate Driver

Littelfuse Unveils IX4352NE Low-side Gate Driver for SiC MOSFETs and High-power IGBTs

Littelfuse, Inc. is excited to announce the launch of the IX4352NE Low-side SiC MOSFET and IGBT Gate Driver. This innovative driver is specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in industrial applications. The key differentiator of the IX

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Date:

05/08/2024

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package. With low-voltage operation of 0.6V, the 16Gb AS4C512M32MD4V-046BIN and 32Gb

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Date:

05/02/2024

The Elegance of a Flyback Controller Without a Dedicated Isolated Feedback Path

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Figure 1: Conventional flyback controller with feedback path based on an optocoupler

The Elegance of a Flyback Controller Without a Dedicated Isolated Feedback Path

Frederik Dostal, Analog Devices, Inc.

Figure 1 shows the architecture of a conventional isolated flyback converter. These converters can be found frequently in power classes of up to about 60 W. A supply voltage is converted to an output voltage with the help of a primary-side switch and a transformer with adjusted turns ratio. Information about th

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Date:

05/01/2024

How the IIoT is Changing the Face of Manufacturing

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Figure 1: Nordic’s nRF9160 SiP is the lowest power complete cellular IoT solution on the market – extending battery life

How the IIoT is Changing the Face of Manufacturing

Lorenzo Amicucci, Business Development Manager, Nordic Semiconductor

Digital computers first disrupted factory automation in the late 1960s. The machines ushered an era of computer aided design (CAD), consistent manufacture of complex components, greater automation using programmable logic controllers (PLCs), and higher productivity. The period was considered the third generation of

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Date:

05/01/2024

Galvanic Isolation Keeps Pace with Control Requirements

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Figure 1: Isolation locations in a PLC

Galvanic Isolation Keeps Pace with Control Requirements

Joachim Hausmann, Toshiba Electronics Europe GmbH

There are two distinct trends in the design of the electronic systems that support motors. On one side are power generation and electrical distribution subsystems that operate at voltages that are moving toward the kilovolt regime. On the other are high-speed MCUs that enable advanced algorithms to optimise sy

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Date:

05/01/2024

New Models Added to CUI Devices' Line of BGA Heat Sinks

New Models Added to CUI Devices' Line of BGA Heat Sinks

New Models Added to CUI Devices' Line of BGA Heat Sinks

CUI Devices’ Thermal Management Group today announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. All BG

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Date:

05/01/2024

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