60V and 100V MOSFETs in TO-Leadless Packaging Technology



SUNNYVALE, Calif. – Alpha and Omega Semiconductor Limited (AOS) introduced the TO-Leadless (TOLL) package in combination with a 60V and 100V Shield-Gate Technology (SGT) providing the highest current capability in its voltage class.  The TOLL package has the highest current capacity due to AOS’innovative technology, which utilizes a clip to achieve the in-rush current. The TOLL packaging technology offers a very low package resistance and inductance due to the clip technology when compared to other TO-Leadless packages.  This packaging technology uses a standard wire-bonding technology which enables improved EMI performance.

The AOTL66608 (60V), AOTL66610 (60V), and AOTL66912 (100V) have a 30% smaller footprint compared to a TO-263 (D2PAK) package and has a higher current capability which enables the designer to reduce the number of MOSFETs in parallel.  The new device’s offer a higher power density compared to existing solutions.  They are ideally suited for industrial BLDC motor applications and battery management.

Pricing and Availability

The AOTL66608, AOTL66610, and AOTL66912 are immediately available in production quantities with a lead-time of 14-16 weeks. The unit price for 1,000 pieces are $4.1, $2.3, and $4.56, respectively.

For more information, please visit www.aosmd.com.