New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications
Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5x6 Package for High Performance and High-Reliability Requirements
Alpha and Omega Semiconductor Limited (AOS) announced its new highly robust power MOSFET LFPAK 5x6 package. AOS’s new LFPAK product offering is available in a wide range of voltages: 40V, 60V, and 100V, and it is designed to withstand harsh environments while maintaining MOSFET performance. The new devices are found in a broad range of applications such as industrial, server power, telecommunications, and solar, where high reliability is required.
AOS’s LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK’s larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. All these features significantly improve the robustness of the MOSFET, and utilizing AOS’s advanced shielded gate MOSFET Technology (AlphaSGT™) enables designers to find an optimized solution to achieve high reliability under the harshest environmental conditions.
“Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability,” said Peter H. Wilson, Marketing Sr. Director of the MOSFET product line at AOS.
For more information, please go here.
