Ampleon showcases RF energy innovations at EDI CON in Beijing
Ampleon announced its participation at the forthcoming Electronic Design Innovation Conference - EDI CON – held in Beijing, China between April 19 – 21, 2016. At their booth, number 607, Ampleon will showcase demonstrations of a plasma light module developed by Luma in collaboration with Ampleon and, a new recently announced solid state oven developed by Midea in collaboration with Ampleon, in addition to a number of GaN and LDMOS RF power transistor applications. Power transistor products featured at the booth will include the latest 0.5 um GaN family, and the BLCU188XR 1,400 Watt extremely rugged LDMOS power transistor housed in ACP-3, thermally optimized package, reducing thermal resistance (Rth) by 30 %.
Also, Rob Hoeben, Vice President and Business Unit Manager Multi Market & RF Energy, Ampleon will be giving a presentation titled ‘RF solid state Energy, paving the way for innovations in consumer white goods’ in the workshop session TU105 in room 406 on 19 April at 1pm. More information on the conference and workshop schedule can be found here. http://
