AVX, a leading manufacturer of advanced passive components and interconnect solutions, offers the lowest profile 0603 and 0805 multilayer organic diplexers available in the market. Compared to equivalent low temperature co-fired ceramic (LTCC) products, AVX's 0603 and 0805 MLO diplexers exhibit superior attenuation, low insertion losses, low parasitics, high heat dissipation, and excellent solderability. Ideally suited for band switching in dual and multiband systems, such as WiFi and WiMax (WLAN/BT); mobile telecommunications, including 3G and 4G LTE (WCDMA, CDMA, and GSM); and GPS, the 0603 and 0805 MLO diplexers measure a scant 0.42mm and 0.55mm in height, respectively.
At heights of 0.55mm or less, the best-in-class 0603 and 0805 MLO diplexers are presented as the lowest profile diplexers currently available in the global market, which proves especially beneficial for engineers engaged in designing next-generation mobile devices, according to Larry Eisenberger, senior marketing application engineer at AVX.
Based on AVX's patented multilayer organic high density interconnect technology, the 0603 and 0805 MLO diplexers employ high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in multilayer stack ups. Expansion-matched to PCBs, the devices also provide improved reliability compared to ceramic and silicon components.
Rated for temperatures spanning -40°C to +85°C and, respectively, for maximum power capacities of 4.5W and 5W, AVX's low-profile 0603 and 0805 MLO diplexers are 100% tested for electrical parameters and visual characteristics and are available with Ni/Au, Ni/Sn, and OSP coatings, all of which are compatible with automatic soldering technologies.