AVX expands Mini-TurboCap capacitor series



AVX Mini-TurboCap Series

AVX, a leading manufacturer of passive components and interconnect solutions, has expanded its Mini-TurboCap(TM) and RoHS Compliant Mini-TurboCap Series with a new 25V rating and an extended capacitance range (up to 39µF) for its 50V parts. Now available in 25V, 50V, and 100V, these state-of-the-art base metal electrode (BME) capacitor series exhibit extremely high volumetric efficiency (CV) in addition to ultra low ESR and ESL in a compact footprint. Capable of conserving considerable amounts of critical board space, both Mini-TurboCap Series are ideal for I/O EMI filtering in military and COTS+ switch mode power supply applications, industrial power converters, radar systems, and aerospace power electronics, among several others.

"The extended voltage and capacitance ratings for our Mini-TurboCap Series BME capacitors are especially beneficial developments for design engineers working in a variety of critical markets, as there are no other capacitors on the market that can match their high CV capabilities in a similarly small footprint," said Pat Hollenbeck, applications engineer at AVX.

Both comprised of X7R dielectric materials, the Mini-TurboCap and RoHS Compliant Mini-TurboCap Series feature an operating temperature range of -55 degrees C to +125 degrees C. Capacitance values for the series' 25V parts extend up to 82µF; for 50V parts, values extend to 39µF, and for 100V parts they extend to 8.2µF. The two series have also been life tested to 1,000 hours at 150% of the rated voltage and +125 degrees C.

Both Mini-TurboCap Series feature stress-relieving lead frames to ensure the effective mechanical decoupling of the chips from the board and mitigate the stress created by board flexing, vibration, and temperature cycling. Mini-TurboCap Series capacitors and their RoHS compliant counterparts also feature 4-pin DIP construction.

Terminations for both series are available in three lead styles: straight (N), formed in (K), and formed out (M). Additionally, lead frames for both series are attached to the chips with high temperature solder, eliminating the risk of solder reflow during assembly to the board.