AVX's polymer tantalum chip capacitors with undertab terminations target high-energy applications

Date
02/10/2014

Categories:
Capacitors, Embedded Systems, Energy Storage, Passive Components

 PDF

TCN PulseCap tantalum solid-electrolytic chip capacitors

AVX, a leading manufacturer of passive components and interconnect solutions, has released its TCN PulseCap™ Series of tantalum solid-electrolytic chip capacitors, a polymer electrode version of AVX’s industry-favorite, high capacitance, and high energy TLN PulseCap Series. Available in the same single, large, low-profile case size (EIA 7361-20) as its parent series, which enables a capacitance range spanning 220μF to 1500μF, the new TCN PulseCap Series capacitors feature undertab terminations for high volumetric efficiency and high PCB assembly density, in addition to a conductive polymer cathode for reduced ignition and low ESR. TCN PulseCap Series capacitors are ideal for use as energy bank capacitors in solid state drives (eSSDs) and external hard disk drives (eHHDs), as well as for a wide range of wireless transmitters, including smart meters and smartcards.

“Featuring a low-profile 2mm height and undertab terminations instead of solder joints on the side of the capacitor body, the new TCN PulseCap Series tantalum chip capacitors enable high volumetric efficiency and PCB assembly density, making them ideal for applications that require both high energy and low profiles, such as eSSD and eHDD devices,” said Allen Mayar, product marketing manager at AVX.

Lead-free compatible and RoHS compliant, TCN PulseCap Series capacitors are rated for -55°C to +85°C and 6.3VDC or 16VDC. The series also features ±20% capacitance tolerance and 0.1CV DC leakage current, and is suitable for 3x reflow solder processing at 260°C. Lead time for the series is 8-12 weeks.

AVX

Related articles

 Automotive-Grade IHLP Inductors for Under the Hood Apps
 Intel Enpirion DC-DC Voltage Bus Converter
 TTI Launches Comprehensive Mil/Aero Resource Center