DesignCon 2014 technical program call for abstracts open until August 5


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DesignCon 2014, a premier educational conference and technology exhibition for semiconductor and electronic design engineers, announced a Call for Technical Papers and Tutorials with a deadline of August 5th. At DesignCon, engineers talk to engineers to find practical solutions to the challenging problems they share in design and verification. We emphasize education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies. Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews. The event solicits abstracts for three types of sessions: technical papers, panels and tutorials. Technical papers, which are up to 25 pages long, address design case studies and application overviews, and are presented in forty-minute sessions. Technical panels are 75-minute presentation/discussion sessions featuring 3-5 panelists plus a panel chair to moderate the discussion. Tutorials are half-day (three-hour) sessions with papers up to 50 pages long, allowing the speakers to cover their topics in greater depth and breadth. Tutorials are scheduled for Tuesday, January 28; the technical paper sessions will be held on Wednesday-Friday, January 29-31; technical panels are scheduled on Tuesday-Thursday at the end of each day's program. To Submit a proposal, prepare the following information: Title of submission Conference track preference, 1st and 2nd choice (choose two from list; Technical Program Committee reserves the right to move a submission if a different track is deemed more suitable to the content presented) Session format, 1st and 2nd choice (half-day tutorial, 40-minute paper session, or 75-minute panel discussion) Audience level (advance, intermediate, introductory) - prerequisites required for advanced and intermediate Key takeaways (400 characters max, REQUIRED) - for use in printed on-site conference guide Summary (5000 characters max, REQUIRED) - used by reviewers to judge your proposal Abstract (999 characters max, REQUIRED) - for use on conference web site if accepted Prerequisites (400 characters max, REQUIRED) - type "None" for introductory topics Comments (800 characters max, REQUIRED) - for reviewers and staff; type "None" if no comments; authors are invited to include links to supplemental documents to support their proposal (e.g., Google Docs link) Speaker/author information (speakers for panels need not be confirmed at time of submission) The DesignCon 2014 Technical Program Committee will review all submissions based on quality, relevance, impact, and originality. Prospective authors are welcome to reference products as long as product references add to the educational value and are presented in an appropriately non-commercial fashion. A. Quality DesignCon papers, panels, and tutorials should be well organized and easily understood. The abstract and summary are judged as indicators of what can be expected of the paper or session. B. Relevance The proposed paper, panel, or tutorial should be highly relevant to the interests of the DesignCon audience in general and the track topic in particular. C. Impact DesignCon papers, panels, and tutorials should contribute to the educational mission of DesignCon. Submissions reporting on important results, methodologies or case studies of special significance will be considered favorably. D. Originality Reports on new design methodologies, case studies for innovative designs or other novel results contribute to the DesignCon goal of providing a high-quality educational program for practicing engineers. However, outstanding proposals on "classical" topics will also be viewed favorably. E. Commercial Content It is acceptable to use a product in a design case study or as a proof of concept for a design methodology. Product promotion is not permitted in DesignCon technical sessions. Evidence of product promotion in a paper, panel, or tutorial proposal will lead to rejection of the proposal. All relevant proposals—including topics other than those listed—will be considered. Submissions on related standards activities are welcome. DesignCon 2014 Topic Categories Optimize Chip-Level Designs for Signal and Power Integrity Overcome Analog and Mixed-Signal Design and Verification Challenges Wireless and Photonic Design & Integration Optimize System Co-Design: Chip/Package/Board Characterize PCB Materials and Processing Characterization Apply PCB Design Tools and Methodologies Design Parallel and Memory Interfaces Optimize High-Speed Serial Design Detect and Mitigate Jitter, Crosstalk, and Noise Leverage High-Speed Signal Processing for Equalization and Coding Ensure Power Integrity in Power Distribution Networks Achieve Electromagnetic Compatibility and Mitigate Interference Apply Test and Measurement Methodology Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques DesignCon 2014