The conference program of the 13th Electronic Cicuits World Convention (ECWC13) has been released. In more than 120 speeches, experts from Europe, Asia and America present the most recent developments in the PCB and SMT sector. One highlight of the event is the Opening Ceremony on 7 May 2014 with keynote speeches by Dr. Ho-ming Tong, ASE Group, Dr. Marc Schweizer, Schweizer Electronic AG and Phil Plonski, Prismark Partners LLC.
The conference sessions are focused on the topics „Base Materials“, „Surface Finishes“, „Design“, „Embedded Technology“ and „Flexible Circuits“ among others. They offer the opportunity to analyse the development of the Asian markets and the opportunities of European electronics manufacturing.
ECWC13 will take place in conjunction with the SMT Hybrid Packaging 2014 exhibition. It is the ideal platform for exhibitors in the field of system integration in microelectronics. New developments in assembly, PCB, soldering, screen printing, EMS, testing, packaging and interconnection technology will be shown.