Based on TDK's SESUB technology (semiconductor embedded in substrate), a Series of highly integrated, IC-embedded multi-channel power management modules is presented as the world's first device of its type for smartphones and tablets. Aimed at reducing lead times and development costs for manufacturers of smartphones and tablets, the new product features a power supply management IC chip that is embedded directly into the substrate. In combination with newly developed surface-mounted capacitors and power inductors, this results in a space-saving footprint that is up to 60 percent smaller than discrete solutions. The highly integrated module offers advanced multi-channel power management capabilities in a single miniature package with dimensions of only 11.0mm x 11.0 mm x 1.6 mm. The major features of the new power management module are its high-efficiency step-down converter power supply in a 5-channel configuration with a maximum output of 2.6 A, and its low-noise, low-loss voltage regulator power supply for up to 23 channels. A highly efficient lithium-ion secondary battery charging circuit is also included. Thanks to the fact that the IC completely embedded in the miniature three-dimensional SESUB structure, the power management module features superior thermal attributes compared with solutions with discrete packaged ICs. The module also offers greatly improved EMC performance due to the self-shielding effect of its design.. TDK
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