Emerson 2019 ASCO Engineering Scholarship Deadline: April 23



FLORHAM PARK, N.J. — Emerson is reminding U.S. engineering students that the deadline for its 2019 ASCO Engineering Scholarship program is rapidly approaching and that the program will continue to accept applications through April 23, 2019.

The program rewards students who have the potential for leadership and contributions to the engineering profession. Two $5,000 scholarships will be awarded to two U.S. engineering students, along with $1,000 grants to their colleges’ engineering departments. Also, Emerson will host the student recipients at “The Amazing Packaging Race” at PACK EXPO International in 2019.

Details and forms are available at https://go.emersonautomation.com/asco-engineering-scholarship.

Since the first award 11 years ago, $110,000 in scholarships have been granted to 22 U.S. students. The engineering departments of the colleges where the recipients are enrolled have received an additional $22,000 in grants for education research. In all, the ASCO engineering scholarship has made a significant contribution to the engineering profession. It is named for Emerson’s brand of solenoid valves, invented in 1910, which led to a heritage of innovation in engineering. It is Emerson’s mission to support and inspire the next generation of innovators.

The scholarship is merit-based and will be awarded on the candidate’s experience and potential for leadership, particularly as it relates to the application of fluid control and pneumatics technologies. A panel of Emerson executives and independent judges will select the recipients.

Students seeking to submit a scholarship application must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2019/2020 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale and be a U.S. citizen or legal U.S. resident.

The scholarship will be awarded at “The Amazing Packaging Race” held the third and final day of PACK EXPO International, Sept. 23 - 25, 2019 in Las Vegas, Nevada. The race, sponsored by Emerson, is a fun and educational event that pits teams of college students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.

For more information visit Emerson.com.