With backplane and subrack demonstrators, ERNI Electronics is providing answers to the dilemma that stems from having systems with increasing performance coupled with ongoing miniaturisation. Using the two-row SMC connectors in a 1.27mm pitch and the 1.0mm MicroSpeed connectors, it is possible to implement the most compact, modular systems with high data rates. This allows highly sophisticated and custom-tailored system solutions to be realised. Many users and customers are concerned with card-edge connector solutions and are seeking alternatives that are more reliable. After all, it is not possible to reliably employ edge-socket connectors in harsh environments exposed to severe vibrations and shock loads. Fretting corrosion can also occur, with inadequately designed and manufactured contacts wearing through due to vibration. By contrast, SMC and MicroSpeed are reliable connector systems, which, with dual-leaf contacts, go to ensure good contact wipe length and secure mating, whilst also satisfying demanding requirements thanks to their high-quality contact surfaces. The trend is towards proprietary solutions that are optimised with regard to their specific requirements. It is precisely here that the concept of the mini backplanes comes into play - offering high performance coupled with minimum space requirements and a high degree of reliability. Fine-pitch connectors offering adequately high performance such as the SMC and MicroSpeed components from ERNI Electronics enable compact system designs with high data rates. SMC connectors with 1.27mm pitch have been deployed successfully in the market for about 20 years and have been consistently further developed. These connectors are frequently used in a number of totally different locations within a system, be this for mezzanine, ribbon cable or coplanar configurations. Unshielded SMC connectors for applications without special high-speed requirements have been utilized in million pieces in applications such as programmable logic controllers. Furthermore, SMC connectors are also available in highly reliable pressfit technology, which makes them ideally suited for passive backplanes. For more demanding applications, the MicroSpeed high-speed connectors in a 1.0mm pitch along with their corresponding power modules are the ideal choice. Using these also makes it possible to address serial high-speed interconnects such as PCI Express 1/2/3, Rapid IO, SATA 1 and 2, Fibre Channel, USB3 and 10 Gigabit Ethernet (10GBASE-T or KR). As shielded connectors, the MicroSpeed components are also ideal for applications with EMC-open housings or particularly demanding requirements in terms of the EMC performance. In addition to the SMC-based demonstrators for mini backplanes presented earlier, ERNI Electronics has now also realised corresponding systems on a MicroSpeed basis in order to highlight the numerous different options offered by these connector families. www.erni.com
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