Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.
LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
LEDPaste NC38HF delivers:
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