Indium Corporation to feature Heat-Spring thermal Interface material at PCIM 2014

Date
04/23/2014

Categories:
Embedded Systems, Thermal Management

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Heat-Spring thermal interface material

Indium will feature its Heat-Spring® thermal interface material at PCIM 2014, May 20-22 in Nuremberg, Germany. Heat-Spring is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs offer uniform thermal resistance at lower applied stresses in compressed interfaces.

The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling. Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.

For more information about Heat-Spring thermal interface materials, stop by to talk to any of Indium’s technical experts at PCIM, stand 7-454.

Indium

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