Up to 64% smaller than leaded devices
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified.
These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.
Nexperia’s MicroPak packages feature the same silicon die as larger PicoGate options, ensuring that electrical performance remains identical to leaded equivalents. MicroPak packages save up to 64% PCB space compared to leaded equivalents while providing a more reliable bond between device and board, thanks to a higher pad size-to-package footprint ratio.
Nexperia’s complete MicroPak range is very broad and includes gates, analog switches, buffers / inverters / drivers, bus switches, translators, flip-flops, decoders / demultiplexers, multiplexers, latches, level shifters and Schmitt-trigger devices.
Twenty solutions in XSON6 (SOT886 and SOT1202) and XSON8 (SOT833-1 and SOT1203) packages are available immediately in Nexperia’s Automotive portfolio – including low-power single-gate and dual-gate functions in AUP (0.8 V to 3.6 V), AVC (1.2 V to 3.6 V) and LVC (1.65 V to 5.5 V) technologies, ranging from gates to translators. In addition, more devices from Nexperia’s MicroPak offering can be released for automotive applications upon request.
