NEWS: INDUSTRY NEWS

    Infineon Enters into Agreement to sell NOR Flash and F-RAM Business to Winbond and Sharpens Focus on Core Growth Areas

    09/16/2026
    Transaction valued at $1.12 billion supports Infineon's strategic focus and profitable growth
    Peter Schiefer, President of Infineon’s Automotive Division

    ­Infineon Technologies AG announced that it has entered into a definitive agreement under which Winbond Electronics Corporation, a Taiwan-based global supplier of semiconductor memory solutions, will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at $1.12 billion on a cash and debt free basis. The business comprises a portfolio of NOR Flash memory as well as F-RAM products serving customers across automotive, industrial and infrastructure markets. Subject to obtaining the required regulatory approvals, the parties currently target closing the transaction in the second half of 2027.

    “The transaction represents a highly compelling strategic outcome for all stakeholders,” said Peter Schiefer, President of Infineon’s Automotive Division. “It allows Infineon to further focus its portfolio and capital allocation on its core growth drivers. At the same time, it enables our NOR Flash and F-RAM business to unlock its full potential.”

    Winbond is a leading provider with a focus on memory solutions which makes the company a good fit to unlock future growth possibilities for Infineon’s NOR Flash and F-RAM business. The combination of Winbond’s existing memory portfolio and Infineon’s NOR Flash and F-RAM business will provide customers with a broad and complementary portfolio of NOR Flash and F-RAM products. Winbond will operate the acquired business as a standalone entity with headquarters in Silicon Valley in the United States.

    Infineon will continue to offer a portfolio of specialty memory solutions, including SRAM, HYPERRAM™, nvSRAM and SONOS based radiation-hardened memory solutions. These technologies remain an important part of Infineon's portfolio across automotive, industrial, infrastructure, aerospace and defense applications, including a strong product offering of high-reliability memory solutions for space missions.

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