Date
07/22/2025
KIOXIA Europe, a world leader in memory solutions, announced today that it has expanded its high-capacity KIOXIA LC9 Series enterprise SSD line-up by introducing the industry’s first 245.76 terabyte (TB) NVMe SSD in 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor. This new capacity and form factor option complements the previously announced 122.88 TB (2.5-inch) model and is purpose-built for the performance and efficiency demands of generative AI environments.
Generative AI places unique demands on storage, including the need to store vast datasets for training large language models (LLMs), and to create embeddings and vector databases that support inference through retrieval augmented generation (RAG). These workloads require storage solutions with large capacity, high speed, and exceptional power efficiency.
Featuring a 32-die stack of 2 terabit (Tb)[3] BiCS FLASH™ QLC 3D flash memory with innovative CBA (CMOS directly Bonded to Array) technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8TB in a small 154 BGA package – also an industry first[1]. This milestone was made possible with advancements in KIOXIA’s high-precision wafer processing, material design, and wire bonding technologies.
KIOXIA LC9 Series SSDs are well-suited for data lakes, where massive data ingestion and rapid processing are essential. Unlike HDDs, which often bottleneck performance and leave costly GPUs underutilised, KIOXIA LC9 Series SSDs enable dense storage in a compact footprint. By delivering up to 245.76 TB, each drive can replace multiple power-hungry HDDs, offering superior performance, lower overall power consumption, fewer drive slots used, and more efficient cooling, which would significantly lower total cost of ownership (TCO).
KIOXIA LC9 Series SSDs Features Include:
● Up to 245.76 TB in 2.5-inch and E3.L form factors
● Up to 122.88 TB available in 2.5-inch and E3.S form factor
● Designed to PCIe 5.0 (max. 128 GT/s Gen5 single x4, dual x2), NVMe 2.0, and NVMe-MI 1.2c specifications
● Open Compute Project (OCP) Datacenter NVMe SSD specification v2.5 support (not all requirements)
● Flexible Data Placement (FDP) support to minimise write amplification and extend SSD lifespan[4]
● Security options: SIE, SED, FIPS SED
● CNSA 2.0 signing algorithm[5], designed with future quantum security standards in mind
“We continue to drive innovation with the new KIOXIA LC9 Series, providing cutting-edge technology that enables our data center and hyperscaler customers to stay ahead,” said Paul Rowan, VP & CMO at KIOXIA Europe GmbH. “The 32-die stack of 2 terabit (Tb) BiCS FLASH™ QLC 3D flash memory coupled with our innovative CBA technology and the E3.L form factor within the LC9 Series SSDs address their unique requirements of Generative AI applications for speed, scale and efficiency.”
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