Leadless Packaging Technology for High-Current Applications

Date
10/01/2018

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SUNNYVALE, Calif.– Alpha and Omega Semiconductor Limited introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.  The TOLL package has the highest current capacity because of AOS’innovative technology which utilizes a clip to achieve the 400A DC at 25°C capability.  The TOLL packaging technology offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.

The AOTL66401(40V)  has a 30% smaller footprint compared to a TO-263 (D2PAK) package, including having higher current carry capability that enables the designer to reduce the number of devices in parallel. This new device offers a higher power density in comparison to existing solutions, and is ideally suited for industrial BLDC motor applications and battery management to reduce the number of MOSFETs. The AOTL66401 has a 0.7mOhm max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature.  The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.

For more information, please visit www.aosmd.com.

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