Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.
Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:
- Low-temperature reflow
- Clear post-reflow flux residue
- High transfer efficiency and low variation
- Excellent response-to-pause
- Low-voiding in bottom termination components (QFNs), BGAs, LGAs
- Excellent wetting
Indium 5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile
high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.
For more information about Indium Corporation’s suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid.
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