MACOM to show highest-power GaN-in-plastic transistors and more at IEEE MTT International Microwave Symposium 2013

Date
05/30/2013

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M/A-COM Technology Solutions (MACOM) will showcase a broad portfolio of products for aerospace and defense, wireless backhaul, CATV, and optical communications applications in booth #930 at the IEEE MTT International Microwave Symposium (IMS) tradeshow in Seattle, Washington, June 4-6, 2013. Meet engineer-to-engineer to solve your unique application design challenges. Ask MACOM about its: Broad catalog of 2000+ reliable standard products Highest power GaN in plastic-packaged power transistors Industry leading shunt diode series E-Band MMIC power amplifier Innovative 120W switch module for TDD-LTE base stations Lowest power EML driver for 100G applications Linear amplifiers for 13/15/18 GHz cellular backhaul The Future of GaN Presentation Hear expert Paul Beasly/MACOM speak about the future of GaN at 1:00 PM on June 4th at the Richardson RFPD Booth # 620: When: June 4-6, 2013; Exhibition Hours: Tuesday, June 4 9:00 AM - 5:00 PM Wednesday, June 5 9:00 AM - 6:00 PM Thursday, June 6 9:00 AM - 3:00 PM Where: Booth 930, Washington State Convention Center, Seattle, Washington IEEE MTT International Microwave Symposium 2013 MACOM

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