TDK Corporation announces the immediate availability to select OEMs of the Chirp CH-201 MEMS-based ultrasonic Time-of-Flight (ToF) sensor with extended sensing range. This ToF sensor utilizes a tiny ultrasonic transducer chip that sends a pulse of ultrasound and then listens for echoes returning from targets in the sensor’s field-of-view. By calculating the distance based on time of flight, the sensor can determine the location of an object relative to a device and trigger a programmed behavior.
TDK’s MEMS ultrasonic technology leverages a proprietary ToF sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power, mixed-signal CMOS ASIC. The sensor handles a variety of ultrasonic signal-processing functions, enabling customers’ flexible industrial design options for a broad range of use-case scenarios including range-finding, presence/proximity sensing, object detection/avoidance and 3D position-tracking.
Following last year’s introduction of CH-101, the first commercially available MEMS-based ultrasonic ToF sensor for consumer electronics, AR/VR, robotics, drones, IoT, automotive and industrial market segments, TDK is expanding the SmartSonic MEMS ultrasonic platform. This will include the CH-201 ultrasonic ToF sensor and associated software solution for room-scale sensing applications, enabling ultralow power, always-on sensing for human presence detection without privacy concerns, among many other use cases.
TDK’s MEMS ultrasonic ToF sensor platform offers numerous advantages over optical ToF sensors:
The Chirp SmartSonic platform (CH-101, CH_101 module, and CH-101 developers kit) is available worldwide through distribution today. CH-201 is entering into mass production and is currently shipping to select customers.
Main features and benefits: