Microsemi delivers power amplifier for nextgen Wi-Fi applications

Date
12/12/2012

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Growing IEEE 802.11ac product portfolio includes PAs and front-end devices

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Microsemi Corporation, a lead provider of semiconductors differentiated by power, security, reliability and performance, has introduced a 5 GHz (gigahertz) LX5509 PA (power amplifier) for IEEE 802.11ac—also known as fifth generation Wi-Fi — wireless access points & media devices. The LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks, allowing optimum system performance by extending the high data rate range. "Our new PA is the second in a series of devices we are introducing to accelerate the proliferation of the next-generation Wi-Fi standard," said Amir Asvadi, VP and GM of Microsemi's Analog and Mixed Signal group. "We will continue to focus on strengthening our 802.11ac portfolio with industry-leading solutions and partnering with world-class WLAN manufacturers to deliver circuits that provide the highest system performance." In addition to its power capabilities, the LX5509 features a standardized pin out. This enables customers to, without layout changes, later upgrade the performance level in their systems with higher power 5 GHz PAs, currently in development at Microsemi. Microsemi's 802.11ac device offerings include the LX5586, the world's first monolithic SiGe (silicon germanium) RF FE (front-end) device. The company recently announced that this innovative device works in conjunction with Broadcom's BCM4335 combo chip for mobile platforms. The company also offers a broad portfolio of IEEE 802.11a/b/g/n devices including power amplifiers, low noise amplifiers, front- end modules and reference designs co-developed with leading WLAN chipset manufacturers. LX5509 Key Features

  • 5 GHz operation
  • Linear output power 19dBm for IEEE 802.11ac 256-QAM 80MHz, EVM < 1.8% @3.3V
  • Linear output power 20dBm for IEEE 802.11n 64-QAM 20MHz, EVM < 3% @3.3V
  • 28dB OFDM power gain
  • 50-ohm input & output match, eliminating need to optimize output matching on PCB;
  • Integrated harmonic filter and output detector
  • Temperature-compensated on-chip output power detector with wide dynamic range.
Packaging and Availability The LX5509 is packaged in a 4 x 4 mm quad flat no-lead (QFN) package and is available for sampling. Microsemi Corporation

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