Molex Fibre Optic Interconnect Solution for the Medical, Video and Telecommunications Industries Wins 2010 Chicago Innovation Award

Molex Incorporated, one of the world's leading electronic connector companies, is please to announce that the company has received a 2010 Chicago Innovation Award for its Circular MT Expanded Beam Interconnect solution. This fibre optic interconnect solution addresses the need for high reliability and performance in the medical, data, video and telecommunications industries. "Innovation is a top priority at Molex as we continually strive to develop solutions that address our customers' needs today and in the future," said Doug Busch, vice president, Molex. "Our Expanded Beam Interconnect is a great example of how we develop solutions to meet the specific requirements of the medical and other data intensive industries where connecting and reconnecting optical cables are critical to reduce the risk of application failure. By working closely with our customers, these innovative solutions deliver a significant improvement in application performance." Molex's Circular MT Expanded Beam Interconnect solution offers a high density optical interconnect requiring minimal cleaning while delivering repeatable optical performance over thousands of mating cycles. Expanded Beam MT Interconnects include high-density, front-panel interfaces such as MPO, Array Connector and Circular MT connectors, as well as backplane connectors such as HBMT™ and BMTP. Each year, the panel of Chicago Innovation Awards judges selects the top 10 winners of innovations that uniquely fulfil unmet needs, spark a competitive response in the marketplace, exceed market expectations, achieve financial success, and improve people's lives. The company's Helieon® Sustainable Light Module was also a finalist for this 2010 award. Helieon is the first plug-and-play sustainable solid-state lighting module to integrate high-efficiency precision lighting with an easy-to-use socketed solution. Last year, the Molex Brad® Ultra-Lock® Connection System was selected as a Chicago Innovation Award finalist and in 2008, Molex won a Chicago Innovation Award for its Solder Charge™ SMT Technology, a printed circuit board adhesion method developed by Molex engineers to provide a stronger and more reliable PCB interface at a lower applied cost. To learn more about the Circular MT Expanded Beam Interconnect solution, please visit: www.molex.com/link/expandedbeaminterconnects.html. Follow us at www.twitter.com/molexconnectors and watch our videos at www.youtube.com/molexconnectors and visit the company's blog at www.connector.com www.molex.com