NXP Delivers Breakthrough 0.37-mm Ultra-Flat Package with Schottky Rectifiers up to 1.5A

Date
02/08/2012

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NXP Semiconductors announced a major new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A. The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current. Average forward current ranges between 0.5 and 1.5A. In addition to offering significant space-saving options, NXP's new Schottky rectifiers also deliver industry-leading power performance due to a huge heatsink at the package bottom. The very low forward voltage of these Schottky diodes reduces power consumption and thereby enables longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5A types, these can be extended to larger devices such as tablet PCs. The rectifiers in DFN1608D-2 are also attractive to manufacturers because of the package's unique side pads, which are tin-plated to protect against oxidation, thereby always allowing side solderability. Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density. The ability to solder the package at the side also enables easy visual inspection of the contact. By eliminating the need to inspect the solder contacts with expensive and complex x-ray equipment, the DFN1608D-2 makes the manufacturing process more cost-effective. Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: "These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size. Tailored to the needs of ultra-thin applications such as smartphones, we have created the flattest leadless plastic package on the market for 1A and above, with performance parameters found only in devices more than four times larger in size today. This portfolio is another great example of innovative, customer-driven design from NXP." About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com

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