News
    Product News
    New connectors support next-generation Intel, AMD and IBM platforms with higher bandwidth

    PCIe Gen 4 Card Edge Connectors Support Speeds up to 16 Gbps

    09/19/2019

    HARRISBURG, Pa. -- TE Connectivity (TE) introduced its new PCIe Gen 4 card edge connectors, which meet industry PCI-SIG Card Electromechanical (CEM) specification 4.0 and support Intel and AMD next-generation platforms with up to 16 Gbps of bandwidth. Designed to support next-generation CPUs for better system application scaling and higher bandwidth in servers, storage, workstations and desktop PCs, TE's new PCIe Gen 4 card edge connectors feature a 1.00mm pitch to enable all generations of PCI Express signaling designs and support speeds of 16 Gbps (PCIe Gen 4), 8.0 Gbps (PCIe Gen 3), 5.0 Gbps (PCIe Gen 2) and 2.5 Gbps (PCIe Gen 1). In addition, the connectors' footprint and mating interface are backward-compatible with each PCIe generation.

    These PCIe Gen 4 card edge connectors are available in a wide variety of configurations, including x1, x4, x8 and x16 (36/64/98/164 positions) standard links as per PCI-SIG CEM specifications. There are three plating options (30u'',15u'' and gold flash), two polyester film options (full cover surface and 10mm x 10mm) and two solder tail options (solder pad and solder tab).

    Learn more at www.te.com.

    Related

    Power Systems Design

    146 Charles Street
    Annapolis, Maryland 21401 USA

    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.