PSMA to hold APEC 2016 Session on 3D power packaging



The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2016 titled, “3D Power Packaging: Emerging Technologies in Embedded Components and Cooling Techniques.” Featuring speakers from leading industry and research organizations, the session will present an up-to-date look at current and future component technologies utilizing high-density 3D packaging. The PSMA-sponsored session will take place on Tuesday morning, March 22, 2016, from 8:30 to 11:55 a.m. at the Long Beach Convention Center in Long Beach, California.

With the power supply industry continually being challenged to increase power density while lowering cost, companies are turning to 3D packaging technologies for additional solutions. A 3D packaging approach using embedded components (actives and passives) and advanced cooling techniques is proving to be the technology offering the fastest time to market for achieving increased power density in a smaller footprint. This solution is already in production in semiconductor, component and power supply designs.

The 3D Power Packaging Industry Session will feature seven invited experts from industry and research to provide attendees with an overview of component technologies and cooling techniques essential for successful implementation. They will also offer insights to help attendees identify potential opportunities for their companies, and to explore the potential of applying this emerging technology to meet their market demands.

Co-chairs of the session, Ernie Parker of Crane of Aerospace & Electronics and Brian Narveson of Narveson Consulting, encourage industry professionals to attend the Industry Session on 3D packaging. Parker stated: “This speaker session will provide a valuable opportunity for attendees to meet other professionals who are active in the evolving application of 3D embedded components in sub-assembly and power supply designs.” Narveson added: “We encourage everyone to register for APEC 2016 and to make plans to attend the 3D Power Packaging session. Participants should also consider joining the other PSMA-sponsored meetings being held throughout the week.”

3D Power Packaging Industry Session