Rogers to Display High-Performance Circuit Materials & Thermal Solutions at 2011 IMAPS

Date
09/25/2011

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Rogers Corporation (NYSE:ROG) will offer both packaging and thermal management solutions at the 2011 International Microelectronics and Packaging Society (IMAPS) Conference and Exhibition in the Long Beach Convention Center, October 11-13, 2011. Visitors can stop by Booth #210 to learn how Rogers materials can help with packaging designs and thermal management. In particular, representatives from Rogers ACMD will highlight the benefits of their Theta® circuit materials, RT/duroid® 6035HTC and ULTRALAM® 3850 high-frequency materials. For designers of high-power, high-frequency circuits, such as power amplifiers and beam-forming networks, Rogers RT/duroid 6035HTC is the answer. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear versus some competitive offerings. The thermally stable material has a z-axis dielectric constant of 3.5 at 10 GHz, low loss by virtue of a loss tangent of 0.0013 at 10 GHz, and is available with reverse-treated, electrodeposited copper foil. Rogers ULTRALAM 3850 liquid-crystal-polymer (LCP) laminates feature low, stable dielectric constant (typically 2.9 at 10 GHz) with tightly controlled thickness uniformity for excellent signal integrity in high-speed circuits. These double-clad laminates exhibit low dissipation factor of 0.0025 at 10 GHz, making them strong candidates for single-layer and multilayer circuits requiring low loss and stable electrical performance. Rogers' halogen-free Theta materials are engineered for outstanding mechanical and electrical performance in high-speed digital circuits. With a coefficient of thermal expansion (CTE) of 50 ppm/°C in the z-axis, they have about 30% less expansion, across the same temperature range, than standard FR-4 for improved reliability of plated through holes (PTHs) in multilayer circuits. The low dissipation factor of 0.0118 at 1 GHz ensures that Theta materials preserve signal integrity in the most challenging digital circuit designs. Theta materials feature a dielectric constant of 3.90 at 1 GHz. In addition, these dependable laminates support RoHS-compliant manufacturing processes and meet UL-94-V-0 level flammability requirements. In addition, members of Rogers TMS Division will also explain the advantages of HEATWAVE™ Metal Matrix Composite (MMC) and COOLSPAN™ Thermal Interface Materials for thermal management in a wide range of electronic circuits. With their exceptional thermal performance and controlled coefficient of thermal expansion (CTE), HEATWAVE materials can dramatically improve the reliability of semiconductor devices and circuits normally subjected to the stress of thermal cycling. By matching the CTE of the mating structures in a circuit or system, such as power modules in electric and hybrid vehicles, can greatly relieve thermal stress. Rogers COOLSPAN Thermal Interface Materials are ideal for high-performance, high-reliability chip packaging applications where thermal management is critical. These non-silicone materials offer outstanding thermal stability, with excellent high-temperature performance and superior rework properties. About Rogers Corporation Rogers Corporation (NYSE:ROG) is a global technology leader in specialty materials and components that enable high performance and reliability of consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure. With more than 179 years of materials science and process engineering knowledge, Rogers provides product designers with solutions to their most demanding challenges. Rogers' products include advanced circuit materials for wireless infrastructure, power amplifiers, radar systems, high speed digital; power electronics for high-voltage rail traction, hybrid-electric vehicles, wind and solar power conversion; and high performance foams for sealing and energy management in smart phones, aircraft and rail interiors, automobiles and apparel; and other advanced materials for diverse markets including defense and consumer products. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, Belgium, China, Germany, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com

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