Manufactured by Renesas Electronics, the new ISL8210M/12M/80M/82M power modules are single-channel synchronous step-down power devices that can deliver 10A or 15A of continuous current at the point-of-load. The family is highly integrated – combining PWM controller, inductor and MOSFETs – to deliver the highest power density of any encapsulated module in their class.
The family simplifies complex, space-constrained power supply designs and speeds time to market by reducing the number of external components required. In addition, all the modules in the family offer pin-to-pin compatibility, thereby enabling designers to quickly select the appropriate current rating and the level of PMBus capability required, without having to modify their PCB layout.
The family comprises 10A and 15A devices that offer an analogue interface and two that come with an additional digital PMBus v1.3 interface: the analogue power modules are the ISL8210M and ISL8212M; and the hybrid digital power modules are the ISL8280M and ISL8282M. The ISL8210M/12M analogue-loop modules offer a higher power density, expanded feature set via pin-strappable settings, and lower cost when compared to previous power modules from Renesas.
Key features of the family include: operation from a single 4.5 to 16.5V wide-input power rail; selectable light-load mode (PFM); high efficiency – up to a peak of 95%; and low thermal resistance, enabling full power operation without a heatsink in the majority of application environments.
All the modules implement the manufacturer’s proprietary R4™ high-speed control loop technology, delivering a compensation-free and stable control loop to eliminate external compensation components, while providing best-in-class fast transient response across the load and input voltage. In addition, the output voltage is fully stable with all ceramic capacitors. The ISL8280M/82M digital PMBus interface modules are also capable of further optimising the control loop, overriding pin-strap settings, and providing extensive telemetry.
Shipping now in the EMEA and Asia Pacific regions, the ISL82xxM family is available in compact and thermally enhanced 12 x 11 x 5.3mm Grid HDA (High Density Array) packages, eliminating the need for additional heatsink or internal fans, and only requiring a few external components for operation. The power module family is supported by four development boards that are designed for the respective evaluation of each of the ISL8210M/12M/80M/82M modules.