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    The Open Harmonized FPGA Module Standard
    “The specification of a module standard for FPGAs opens up new sales channels for semiconductor manufacturers, embedded module manufacturers, and VARs/system integrators, while offering customers all the benefits they may already know from computer-on-modules.” – Ansgar Hein, Chairman

    SGET Shakes Up FPGA Market with World Premiere of oHFM

    01/09/2026

    ­The Standardization Group for Embedded Technologies e.V. (SGET) today announced a paradigm shift in embedded design with the official release of the Open Harmonized FPGA Module (oHFM) specification. As the world’s first open and vendor-independent FPGA module standard, oHFM brings the proven success of Computer-on-Module (COM) principles to the FPGA ecosystem, offering a new level of flexibility for developers and silicon partners alike.

    Enhancing Design Flexibility

    Traditionally, FPGA-based designs required highly specialized carrier board layouts, often tailored to a specific silicon architecture. The oHFM standard introduces a harmonized pinout and interface philosophy that complements the offerings of leading silicon vendors. This allows developers to more easily scale their designs across different performance classes and manufacturers, reducing design complexity and accelerating time-to-market.

    “The oHFM standard is a major step forward in creating a collaborative ecosystem for FPGA technologies,” says Ansgar Hein, Chairman of SGET. “By harmonizing interfaces and form factors, we are providing the industry with the same modular flexibility and scalability that has driven innovation in the ARM and x86 markets for years.”

    Two Paths, One Standard: oHFM.c and oHFM.s

    To meet the diverse requirements of industrial, medical, and other applications, the oHFM standard provides two distinct yet harmonized variants:

    • oHFM.c (Connector-based): Optimized for high-performance applications and modularity. Utilizing high-speed board-to-board connectors, it offers four scalable sizes (S to XL) and is ideal for prototyping, high-density I/O, and easy field upgrades.
    • oHFM.s (Solderable): Designed for cost-sensitive, high-volume production. This variant, also available in four scalable sizes (S to XL), leverages Solder-on-Module technology for maximum mechanical ruggedness and a low-profile design.

    Built for the Future: From Entry-Level to High-End

    The oHFM specification is engineered for longevity. It supports everything from low-power entry FPGAs to high-performance SoC-FPGAs featuring 112 Gbps PAM4 SERDES and integrated RF ADC/DACs. With five scalable module sizes (from Small to Extra Large), oHFM provides a future-proof roadmap for AI-driven edge computing, 5G/6G infrastructure, and advanced signal processing.

    Join the Growing Ecosystem

    The oHFM journey is an open invitation to the entire industry. SGET encourages developers, silicon vendors, and system integrators to contribute to this evolving standard. Detailed Design Guides and reference platforms are currently being finalized to ensure a smooth adoption process for all members.

    Availability

    The oHFM specification can be downloaded for free here.

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