SMT Hybrid Packaging 2014 offers communication platform for young engineers

Date
04/01/2014

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From the 6th to 8th of May 2014 SMT Hybrid Packaging, a leading exhibition for System Integration in Micro Electronics, opens its doors in Nuremberg. One highlight for young engineers is in hall 9. Here, the Beratungsgruppe Wirth + Partner offers a free of charge career consulting. It includes among other things a target oriented career coaching and an application package’s checking service. A job board informs about vacant positions of present exhibitors and enables the interested visitors to have a first face to face discussion with the prospective employer.

Forums and joint stands offer expert knowledge
By the various forums, the young engineer has the unique opportunity to gain expert knowledge about the latest topics and trends. In hall 7 there is the opportunity to learn about the current state of MID_Technology and new series applications from all relevant technology sectors.

In hall 6, there is the possibility to get a very special impression: Under the motto “Industry 4.0 – with new technologies towards lot size 1” the Fraunhofer IZM has a live production line. Visitors are welcome to experience it in operation modus.

The joint stands offer the young engineers extensive expert knowledge. At the „EMS Intersection“ in hall 9, an insight into the world of contract manufacturers can be gained. The joint stand „Optics meets Electronics“ in hall 6 is initiated by Fraunhofer IZM Berlin and highlights the significance of optical technologies in the electronics fields, as well as the Photonic Systems Integration.

Three days at the SMT Hybrid Packaging, is the ideal communication platform to meet all key players of the industry and to build up a network.

Electronic Circuits World Convention after 12 years for the first time back in Germany
Parallel to the exhibition, the 13th Electronic Circuits World Convention (ECWC13) will take place from 7- 9 May 2014. On three conference days, in 26 sessions with 123 presentations, ECWC13 examines new processes, current technologies and changing market dynamics of the printed circuit board industry. Students will get a discount on the participation fee.

SMT Hybrid Packaging 2014

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