STMicroelectronics, a semiconductor leader serving customers across the spectrum of electronics applications, announced that Qualcomm Technologies intends to add software support for ST’s inertial sensor solutions including its award-winning iNEMO inertial module. The Companies expect that the support will enable the rapid introduction of Android smartphones based on Qualcomm Snapdragon processors with minimized power consumption and high-performing sensor capabilities through the use of hardware features integrated into the sensor. The reference software is already available to address the specific needs of OEMs creating new devices.
While the agreement extends to all of ST’s inertial modules and sensors (motion, environmental, and acoustic), first efforts will focus on supporting ST’s award-winning LSM6DS3 inertial module, recipient of the MEMS & Sensors Industry Group ‘Product of the Year’ recognition, in key Qualcomm Technologies’ reference designs. The LSM6DS3 is an always-on, low-power inertial module combining a 3D accelerometer and a 3D gyroscope with superior sensing precision. The unique, flexible architecture of ST’s sensors complements Snapdragon’s ultra-low power approach to contextual-data processing. It supports extended battery life with Qualcomm All-Ways Aware hub for Android background sensor functions and numerous value-added features including the fusion of sensors with location technology, modem, and camera subsystems.
“Qualcomm Snapdragon products constitute one of the most technologically influential ecosystems in our increasingly mobile world,” said Keith Kressin, senior vice president, product management, Qualcomm Technologies. “We are pleased to work with ST to bring support for Snapdragon based platforms offering users improved sensing capabilities with improved battery life. Our joint efforts in offering superior, robust, tested, and certified solutions will help OEMs quickly and efficiently implement across regions.”
“We continue to see the expansion of different sensor types and combinations across the smartphone and mobile markets globally, and the work between ST and Qualcomm Technologies is expected to further grow the types of sensors in these devices,” said Andrea Onetti, General Manager, MEMS Sensors Division, STMicroelectronics. “We believe that the combination of ST sensors and Qualcomm Technologies’ processors in superior, robust, tested, and certified solutions that OEMs can design-in quickly can enable waves of new ultra-low-power devices to amaze and excite the ecosystem.”
PDF
