The Power Sources Manufacturers Association (PSMA) is pleased to announce the first International Symposium on 3D Power Electronics Integration and Manufacturing to be held June 13-15, 2016, in Raleigh, North Carolina. Professionals from the world’s leading power electronics, packaging and manufacturing societies and associations are bringing together designers and manufacturers to address the future of integrated power electronics design, and advance the 3D power electronics systems of the future.
The 3D-PEIM symposium is underwritten by the PSMA as part of its ongoing commitment to educate and inform the power electronics industry. Other supporting organizations include: the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); the International Microelectronics, Assembly, and Packaging Society (IMAPS); North Carolina State University; the University of Maryland; and Virginia Tech.
The symposium is all about electrical-physical design and the 3D manufacturing of power electronic systems. With the wide interest in seeing hardware, both dialogue and lecture speakers have the opportunity to display their hardware during the breaks and receptions. (The Call for Dialogue Papers is open through June 6, 2016) The symposium also offers tutorials to provide background and insight into many physical design approaches and technologies.
Offering a full slate of presentations on topics ranging from additive manufacturing to embedded components and integrated thermal management, the symposium is designed to stimulate conversation and idea sharing between circuit, packaging and manufacturing engineers.
Exhibitors are welcomed to reserve tabletops to show what is possible in packaging and manufacturing of 3D power electronic systems. For further information, contact the PSMA or the General Chairman Prof. Douglas Hopkins, NC State University at firstname.lastname@example.org .