TDK Corporation introduces the E13 EM series (ordering code: B8280*F*). These IGBT/FET gate drive transformers are designed for automotive 500-V battery systems, enabling reliable isolation in traction inverters and compact DC-DC converters. By meeting stringent creepage and clearance requirements, this new series supports safe and efficient power conversion in xEV platforms, where robust insulation and space-efficient design are crucial to next-generation electrified mobility.
The E13 EM series features a compact SMD design built on a MnZn ferrite core, with a footprint of 18.6 x 14.6 mm and a height of up to 12 mm. The components support typical operating frequencies between 100 kHz and 400 kHz and are available for either flyback or push-pull topologies. They have inductance values ranging from approximately 1.8 µH to 240 µH and saturation currents of up to 9 A. This enables design flexibility across various power architectures. Low leakage inductance and optimized winding structures ensure stable signal transmission and high efficiency in applications with fast-switching power semiconductors.
A key feature of the E13 EM series is its advanced insulation system. The transformers have creepage distances of up to 6.3 mm and clearance distances of up to 5.5 mm and meet the requirements for basic insulation at 500 V (DC) and reinforced insulation at 300 V, compliant with IEC 60664-1 and IEC 61558-2-16. The components are specified for transient overvoltages up to 2500 V and a partial discharge extinction voltage of 900 V. They are qualified to AEC-Q200 Rev. E and designed for operation from -40 °C to +150 °C, meeting the reliability requirements of automotive applications.
Main applications
- AC-DC power supplies
- Isolated DC-DC converters (flyback and push-pull topology)
- Gate drive transformers for IGBT/MOSFET
- xEV inverter and auxiliary power systems
Main features and benefits
- Insulation compliant with IEC 60664-1 and IEC 61558-2-16
- Basic insulation: 500 V DC working voltage; reinforced insulation: 300 V (RMS), OVC II
- Compact SMD design: 18.6 x 14.6 mm footprint, 12 mm max. height
- Wide operating temperature range: -40 °C to +150 °C
- Qualified to AEC-Q200 Rev. E
- RoHS compatible
- Suitable for lead-free reflow soldering (JEDEC J-STD-020F)
Further information on the products can be found here.