NEWS: PRODUCT NEWS

    Teradyne Introduces Omnyx Edge, Inline Board Test for Physical and Edge AI

    11/10/2026
    The Omnyx family extends from the data center to the edge, bringing inline test to the compute, sensing, and motion boards of automotive, robotic, and edge devices.
    Teradyne Omnyx Edge brings inline board test to the compute, sensing, and motion boards behind physical and edge AI.

    ­Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today introduced Omnyx Edge, an inline board test platform for physical and edge AI. Omnyx Edge extends the Omnyx family from the data center to the edge, testing the boards that let physical and edge AI devices perceive, decide, and act.

    AI is expanding beyond the data center into the physical world. Robots carry onboard AI compute alongside dense sensing and dozens of joint and actuator drives. Factories and logistics sites are deploying AI at the point of use, and vehicles are consolidating control units into central compute and zonal controllers. Each of these boards is denser, more valuable, more power-hungry, and often more safety-critical than the board it replaces, which raises the value of catching defects inline, before the board is built into a vehicle or robot.

    Omnyx Edge tests all three board-level layers of a physical AI system:

    • Intelligence: AI compute modules, and robot and domain controllers
    • Sensing: camera, radar, lidar, and sensor-fusion boards
    • Motion: power conversion, motor control, joint drives, and actuation

    “The next wave of AI runs on edge devices that must perceive, decide, and act in real time, and every board inside them carries more compute, more power, and more responsibility than ever before,” said Regan Mills, president of the Product Test group at Teradyne. “Omnyx established our AI board test capability in the data center. Omnyx Edge brings that capability to the edge, so manufacturers catch defects before the board is built into the product as robotics and industrial edge AI programs scale.”

    Key Features and Benefits

    • Boundary scan coverage. Boundary scan and device programming, including third-party integration, through an updated system controller extend coverage to dense compute boards with limited physical access.
    • PowerSense touchless sensing. Touchless pulse-width modulation (PWM) sensing validates the DC-DC converters and power stages that feed AI processors and motion boards.
    • LEDSense. Extends optical test coverage to onboard LEDs on edge AI boards.
    • Built for the automated factory. A modern programmable logic controller (PLC) and human-machine interface (HMI) architecture, together with handler control, improves factory integration and throughput.
    • AI-based preventive maintenance. Protects uptime and overall equipment effectiveness (OEE) on high-value, high-volume lines.

    For more information, go here.

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