Versarien has confirmed that it will take part in an upcoming seminar hosted by the Technology Strategy Board (TSB), in association with UK Trade & Industry. The Innovate UK event will showcase some of the new generation of British start-up companies that the organisation been able to assist, by taking early-stage research and transforming it into commercially viable business ventures with truly global potential. Versarien's Technical Director, Will Battrick, will give a presentation detailing the TSB's contribution to its success, with a series of four separate projects all helping it to secure funding. The company, located in Cinderford, Gloucester, has received a great deal of press attention in recent months, following the release of its ground-breaking Versarien Cu product. This highly advanced thermal interface material, based on a micro-porous metallic material enables enhanced levels of heat transfer from high density electronic systems - as much as an order of magnitude better than conventional heat sink implementations. It can be highly effective when applied to a broad range of different industry sectors, from telecommunications to lighting, from aerospace to motorsport. Versarien has also received a string of industry accolades - including a HP Smart Business Award, an MWP Advanced Manufacturing Award, a Racecar Engineering Award and the Gold Medal at the Start-Up Games. "The TSB has played a vital role in the development of our company, as well as countless others," states Versarien's Will Battrick. "In these financial uncertain times, getting a new business off the ground is more difficult than ever and the support we have received from the TSB has been of huge benefit to us." Innovate UK
