Vicor announced their latest entries in its portfolio of isolated bus converter modules (BCMs®) based on the company's award-winning Converter housed in Package (ChiP) power component platform. Supplying up to 1.75 kW at 50 V with 98% peak efficiency and power density of 2750 W/in3, Vicor's ChiP BCM fixed-ratio power converters deliver 5X the power density of competing solutions, further extending the company's power performance leadership in this product category.
Vicor has also introduced digital telemetry and control capabilities for its ChiP BCM portfolio, available as an option for the new 1.75 kW modules and previously announced 1.2 kW modules. This PMBus™ compliant digital interface option gives system designers access to the ChiP BCM's internal controller, enabling digital communication with an array of ChiP BCMs via a single bus for control, configuration, monitoring and other telemetry functions.
Vicor's ChiP BCMs' power performance profile is made possible by the underlying ZCS/ZVS Sine Amplitude Converter™ topology. Operating at megahertz switching frequency, ChiP BCMs enable fast response time and low noise operation at industry leading efficiencies. High fixed frequency operation also simplifies and reduces the size of external filter designs, yielding additional cost savings and accelerating time to market.
The new ETSI and ITU compliant 1.75 kW modules support a nominal input voltage of 400 V and nominal output voltage of 50 V, with a K-factor of 1/8. Vicor's 1.2 kW and new 1.75 kW BCMs are offered in the 6123 package. Standard BCM features include bidirectional operation, under-over-voltage lockout, over-current, short circuit and over-temperature protection.
"With the introduction of our newest ChiP BCMs, we've again raised the bar for bus converter power density while introducing new digital communication functionality for customers seeking flexible control and monitoring capabilities," said Stephen Oliver, VP of VI Chip product line, Vicor. "These features extend the value and versatility of the ChiP BCM product family, enabling power engineers to achieve new levels of system power performance for high voltage DC distribution in datacenter, telecom and industrial applications."
Converter housed in Package (ChiP) Platform
Vicor's ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiP-based power modules provide superior thermal management supporting unprecedented power density. Thermally adept ChiP-based modules enable customers to achieve low cost power systems with previously unattainable system size, weight and efficiency attributes, quickly and predictably. The ChiP platform embodies a modular power system design methodology that enables designers to achieve high-performance, cost-effective power systems from AC or DC sources to the Point of Load using proven building blocks.
Pricing and Availability
Vicor's 1.75 kW ChiP BCMs and 1.2 kW ChiP BCMs are available today – pricing for OEM quantities is $170.00 and $120.00 respectively. The digital telemetry and control options are priced separately.