Vicor to showcase their latest ChiP technology at PCIM 2013

Date
05/08/2013

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Vicor will be exhibiting at PCIM 2013 in Nuremberg, the international conference and exhibition for power electronics and intelligent motion. Vicor will showcase its latest ChiP technology "Converter housed in Package"; a packaging technology that provides a high performance, scalable and cost-effective platform for advanced power components. In addition, it will unveil the newest additions to its portfolio of high-performance, high-efficiency power management solutions and host demonstrations designed to showcase the latest innovations in power electronics from AC to the Point of Load. Among the products in the spotlight will be Vicor's Picor® Cool-Power® ZVS buck regulator product line for high-efficiency point-of-load DC-DC regulation and the recently announced user-defined, high-performance VI Chip PRM modules incorporating Vicor's high-frequency ZVS buck-boost technology. These customer-configurable VI Chip PRM modules can deliver up to 500 Watts at over 97% efficiency, at unprecedented power densities of up to 1,700 W/in3 (103 W/cm3). PCIM attendees can visit Vicor in Hall 9 Stand 155. Vicor will also present two papers at the conference: • Controlled-Bus Architecture with Voltage Equalization: a system approach to higher efficiency in low voltage DC distribution • Control of a Discontinuous-Conduction-Mode ZVS Buck-Boost Topology for Microprocessor Core Power Vicor

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