Automotive & Transportation

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Infineon’s PSOC™ 4 HVPA-SPM 1.0 microcontroller – bringing advanced intelligence to automotive battery management systems

Infineon Launches PSOC 4 HVPA-SPM 1.0 – Bringing Intelligence to Automotive Battery Management Systems to Enable Zonal Architectures

Infineon Technologies AG introduces the PSOC™ 4 HVPA-SPM 1.0, an advanced microcontroller designed for high-voltage Li-ion battery management in electric vehicles (xEVs). The microcontroller combines precision, safety, and programmability, while supporting zonal architectures and the transition to Software-Defined Ve

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Date:

11/13/2025

Mahr Inc. Introduces the MarSurf M 510 Series: A Compact, Versatile Mobile Surface Measuring Solution

Mahr Inc., a leading provider of dimensional metrology solutions, today announced theMarSurf M 510 Series, a new mobile surface measuring instrument designed for versatility. With its lightweight, compact design and the smallest skidless probe system available on

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Date:

11/12/2025

Taiwan Semi Adds First SMC/SMB Devices to Its Automotive-Grade 24V SUPER CLAMP TVS Series

Taiwan Semiconductor, global supplier of discrete power electronics devices, LED drivers, analog ICs, TVSs and ESD protection devices, introduces new automotive-grade 24V SUPER CLAMP snapback TVS devices in compact SMC and SMB surface-mount packages. With lower clamping voltages, higher peak pulse currents (I

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Date:

11/12/2025

EV Battery Testing Market to Grow at 18.4% CAGR Through 2030

According to the latest study from BCC Research, “Global EV Battery Testing Market” is projected to increase from $4 billion in 2025 to $9.4 billion by the end of 2030, at a compound annual growth rate (CAGR) of 18.4% from 2025 through 2030. The report segments the market for EV batter testing by testin

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Date:

11/10/2025

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Figure 1: Thermal at 12VIN, 0.6VOUT, 20A load in room temperature

Low-Voltage, High-Current Design for Advanced Processing Solutions

Haisong Deng, Senior Applications Engineer, Analog Devices

Power solutions for advanced processing require several low voltage supplies, including 1.1V for DDR, 0.8 V for core, and 3.3 V/1.8 V for I/O devices. Because of the high density of semiconductor integration, the microprocessor is more power-hungry and requires more supply current. There is also a high dema

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Date:

11/01/2025

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Figure 1: A diagram displaying a PoE Switch at the center, distributing both network connectivity and power to various peripheral devices like IP cameras, IP phones, and wireless access points

Power Over Ethernet: Driving Simplicity and Intelligence at the Edge

Jeff Kring, Bel Fuse

Ethernet has long been the backbone of digital communication. It is valued for its ability to support high data rates over long distances and its versatility across consumer, commercial, automotive, and industrial sectors. However, as the demand for intelligent edge devices grows, Ethernet is evolving. Power ov

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Date:

11/01/2025