Automotive & Transportation

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Material Demand for EV Batteries to Reach 22.2 Million Tons by 2036

Material Demand for EV Batteries to Reach 22.2 Million Tons by 2036

­As electric vehicle sales continue to increase, demand for electric vehicle battery materials grows with it. However, as pack and cell designs evolve, material demand trends emerge across many components. Minimizing cost and maximizing range, through improvements to energy density, are the primary considerations fo
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Date:
02/20/2026
ABLIC Launches Automotive Shunt Reference IC with Industry's Best ±0.1% Output Voltage Accuracy

ABLIC Automotive Shunt Reference IC: S-19760/1 Series

­ABLIC Inc., a member of the MinebeaMitsumi Group, today announced the launch of the S-19760/1 Series automotive shunt reference ICs, which achieve the industry’s highest (*1) output voltage accuracy of ±0.1% and the industry’s lowest (*1) output voltage temperature coefficient of ±20ppm/℃. The new S-19760
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Date:
02/18/2026
Temperature Sensors: TDK launches High‑Reliability Automotive NTC Thermistors Rated for +175 °C

Temperature Sensors: TDK launches High‑Reliability Automotive NTC Thermistors Rated for +175 °C

­TDK Corporation announced that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026. To drive higher automotive performance, more powe
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Date:
02/17/2026
STMicroelectronics' Fast-Acting Isolated Gate Drivers for Smaller, Safer Automotive Modules

STMicroelectronics' Fast-Acting Isolated Gate Drivers for Smaller, Safer Automotive Modules

­STMicroelectronics’ STGAP2SA and STGAP2HSA automotive-grade, galvanically isolated 4A gate drivers with 60ns response time and close part-to-part matching allow high switching frequencies for increased power density and efficiency. Suitable for IGBTs and silicon MOSFETs operating with a hi
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Date:
02/17/2026
Infineon and BMW Group Join Forces to Shape the Future of Software-Defined Vehicles with the Neue Klasse

Infineon and BMW Group Join Forces to Shape the Future of Software-Defined Vehicles with the Neue Klasse

­Infineon Technologies AG plays an important role in shaping the software-defined vehicle architecture of BMW Group’s Neue Klasse, a platform that redefines individual mobility by combining electrification, digitalization, and sustainability. By delivering an integrated, flexible, and future-ready electrical/electronic (E/E
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Date:
02/16/2026
TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

­TDK Corporation announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable en
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Date:
02/11/2026
Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

­Silanna Semiconductor, a global provider of high-performance mixed-signal solutions, today announced its FirePower™ laser firing system ICs for smaller, more efficient LiDAR and rangefinder applications are available in production quantities.  These devices have been developed to significantly reduc
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Date:
02/11/2026
Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

­Allegro MicroSystems, Inc., a global leader in power and sensing solutions for motion control and energy-efficient systems, today introduced the ACS37017, a new Hall-effect current sensor that sets the industry benchmark for accuracy. With the launch of the ACS37017, Allegro completes a strategic expansion of
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Date:
02/10/2026
Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

­Microchip Technology announced a collaboration with Hyundai Motor Group (HMG) to explore the adoption of advanced in-vehicle network solutions based on 10BASE-T1S Single Pair Ethernet (SPE) technology. This cooperation effort is intended to support the development of more efficient, reliable and scalable ve
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Date:
02/06/2026
Standardized Testing is Critical for Emerging Automotive SerDes and Zonal Architectures

Click image to enlarge

Figure 1: Software defined vehicle

­Emerging SerDes standards such as OpenGMSL, MIPI A-PHY, and ASA are designed to support high-bandwidth, asymmetric data links between sensors and central processing units. These standards are crucial for managing the growing volume of sensor data, supporting zonal architecture, and ensuring functional safety in
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Date:
02/01/2026
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