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Communications & Datacom

 




 

 

Communications & Datacom

January 2015
Power Integrations' LinkSwitch-4 switcher ICs pass US and EU CoC efficiency rules

LinkSwitch-4 CV/CC primary-side regulated (PSR) switcher ICs

Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, announced the LinkSwitch-4 family of CV/CC primary-side regulated (PSR) switcher ICs. The LinkSwitch-4 product family features an advanced adaptive base and emitter switched drive scheme for bipolar junction
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Date:
01/29/2015
AVX's latest high-voltage stacked SMPS capacitors suit high voltage apps

AVX RV Series capacitors

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced a new RoHS-compliant series of high voltage, DIP-leaded stacked SMPS capacitors. Rated for 1,000–5,000V and capacitance values spanning 100pF to 15µF, the new RV Series capacitors feature low ESR and ESL, low DC leakage
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Date:
01/28/2015
Altium, a leader in Electronic Design Automation, and Valydate, a leader in Schematic, Signal and Power Integrity analysis, announced a strategic partnership aimed at easing the time-consuming visual inspection and debugging process of electronic schematics with ValydateVERA, a powerful design analysis and verification
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Date:
01/28/2015

Powervation's digital controller family is VR12/12.5-compliant

Powervation's digital DC/DC controllers for servers, high-end desktop, and embedded computing systems

Powervation, a leader in digital power, announced its latest series of digital DC/DC controllers for servers, high-end desktop, and embedded computing systems. The PV3103, PV3104, and PV3202 devices feature single and dual phase outputs and support both PMBus and Intel’s VR12.5 Serial VID (SVID) bus. The highly
. . . Read More
Date:
01/22/2015
STMicroelectronics, a semiconductor leader serving customers across the spectrum of electronics applications, and CMP (Circuits Multi Projets) have made ST’s BCD8sP technology platform for smart-power ICs available for prototyping to universities, research labs, and design companies through the silicon brokerage
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Date:
01/21/2015
Vishay's BiAs single-line ESD protection diode saves board space

Vishay Semiconductors' VESD15A1-HD1-G4-08

Vishay Intertechnolog released a new bidirectional and symmetrical (BiAs) single-line ESD protection diode for portable electronics that provides a reverse avalanche breakdown voltage above 15.5 V and a low forward voltage in the ultra-compact LLP1006-2L package. With a small 1.0 mm by 0.6 mm footprint
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Date:
01/21/2015
Linear's five-output ultralow-jitter clock distributor with PLL provides novel multichip output synchronization

LTC6950 low phase-noise integer-N synthesizer core with an ultralow jitter clock distribution output section

Linear Technology announced the LTC6950, a low phase noise integer-N synthesizer core with an ultralow jitter clock distribution output section. The LTC6950 is ideal for generating and distributing the low jitter signals essential to clocking data converters with a high signal-to-noise ratio (SNR). Maintaining
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Date:
01/21/2015
Melexis' low noise single-coil fan driver IC offers built-in current limiting functionality

MLX90297 600mA single-coil fan driver IC

Melexis announced the MLX90297 600mA single-coil fan driver IC. Aimed at development of energy efficient cooling system designs, this latest device adds to the company’s portfolio of All-in-One single coil fan drivers, and is a further development of the successful MLX90287 device. It integrates a high sensitivity
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Date:
01/21/2015
Molex's wire-to-board solution packs high power in a small footprint for top-end server applications

EXTreme Guardian connector

Molex announced the addition of 2, 3, 4, 5, and 6 circuit harness connector components to its EXTreme Guardian Power Connector system. The new components include non-overmolded latching cable receptacle housings, terminal position assurance clips (TPAs), and latchable vertical and right angle headers providing
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Date:
01/21/2015
AVX creates the first 0201 tantalum capacitor

AVX's sub-millimeter 0201 TACmicrochip

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the world’s smallest and lowest profile tantalum capacitor: the new sub-millimeter 0201 TACmicrochip. Measuring only 0.6mm x 0.35mm x 0.35mm, the new 0201 E case TACmicrochip Series SMD tantalum capacitors deliver
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Date:
01/20/2015
TI’s N-channel power MOSFETs claim industry’s lowest resistance

CSD16570Q5B and CSD17570Q5B NexFET MOSFETs

Texas Instruments introduced 11 new N-channel power MOSFETs to its NexFET product line, including the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry’s lowest on-resistance (Rdson) in a QFN package. In addition, TI’s new 12-V FemtoFET CSD13383F4 for low-voltage
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Date:
01/19/2015
EdgeMate connectors from Molex now available through TTI

EdgeMate connector

Molex’s EdgeMate power connectors offer positive PCB-locking and significant cost savings for wire-to-edge-card terminations in appliance, industrial and lighting applications. The devices are now available from TTI, a leading specialist distributor of passive, connector, electromechanical and discrete components EdgeMate
. . . Read More
Date:
01/19/2015
Cree’s PT62SCMDxx dual SIC MOSFET drivers now at Mouser

PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree

Mouser Electronics, a leading authorized distributor with the latest in semiconductors and electronic components, is now stocking the PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree. Designed to drive the CREE CAS300M17BM2 SIC MOSFET modules, the PT62SCMD12 and PT62SCMD17 single-board solutions are dual silicon
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Date:
01/19/2015
Morgan Advanced Materials (MGAM) announced its extensive range of ceramic capacitors for high voltage DC and AC and high power radio frequency (RF) applications. MGAM’s line of high voltage ceramic capacitors includes high voltage encapsulated discs, live line capacitors, and voltage multiplier assemblies,
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Date:
01/15/2015
Vishay Intertechnology's IHLP 2020 Inductors operate to +155°C

IHLP low-profile, high-current inductors in the 2020 case size

Vishay Intertechnology launched two new IHLP low-profile, high-current inductors in the 2020 case size with high operating temperatures to +155°C. Offering low profiles of 3 mm, the Vishay Dale IHLP-2020CZ-51 and automotive-grade IHLP-2020CZ-5A provide a wide range of inductance values from 0.22 µH to 15 µH. With
. . . Read More
Date:
01/15/2015
Faster charging technique boosts battery's capacity

A novel rapid charging technique leads to enhanced conductivity and capacity

In the quest to develop higher-capacity, longer-lasting batteries, the focus is typically on materials or fabrication techniques. While developing a new way to study and observe battery performance in realtime, a team of researchers from the University of Maryland also discovered that by altering how their battery
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Date:
01/15/2015
Newark element14 has launched the Atmel Xplained Board, (SAMA5D4-XULT) which features an ARM Cortex-A5 microprocessor. This development kit allows users to evaluate, prototype and create high performance, application-specific designs. The SAMA5D4-XULT from Atmel includes 4Gb DDR2 external memory,
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Date:
01/15/2015
Stackpole expands tight tolerance and TCR value ranges

Stackpole's thin film precision RNCF Series

Stackpole's popular thin film, precision RNCF Series has expanded its value ranges to be one of the broadest in the industry for 0.01% tolerances and 10 ppm TCR. * RNCF0402 - 49.9 ohms to 12K ohms * RNCF0603 - 24.9 ohms to 100K ohms * RNCF0805 - 24.9 ohms to 200K ohms * RNCF1206
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Date:
01/15/2015
jb Capacitors releases JFV series of X2 EMI suppression film capacitors

JFV series metallised polypropylene film capacitor

Components Bureau introduces the JFV series of X2 electromagnetic interference (EMI) suppression film capacitors from specialist capacitor manufacturer jb Capacitors. Featuring a maximum mains voltage rating of 275 to 310Vac and a wide range of lead pitches and capacitance values, the JFV series is suitable
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Date:
01/15/2015
Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014, according to IHS Technology. Global revenue this year from shipments of wireless power receivers
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Date:
01/15/2015
Torex Semi releases pushbutton reboot controller IC

XC6190 series push button reboot controllers

Torex Semiconductor has developed the XC6190 series of pushbutton reboot controllers, which are used for system reboot by means of a signal input from external buttons such as on a wearable device. The quiescent current in the standby state is a very small 0.01μA (TYP.). On internally-fixed reboot delay
. . . Read More
Date:
01/14/2015
Hirose's latest long-life I/O docking connector has a novel contact structure

The 3800 Series I/O connector

Hirose, a leader in the development of innovative connector solutions, offers a rugged I/O connector that combines small size and light weight with high reliability and long operating life. The compact 3800 Series I/O connector is designed for cable and docking station applications within consumer, industrial,
. . . Read More
Date:
01/14/2015
Machine-to-machine methods, (or M2M), intelligent embedded and/or smart fusion have been around in some form for many years. The Internet of Things (IoT) goes way beyond this capability and interconnects virtually unlimited numbers of smart objects and changes the way we interact with our environment. To help
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Date:
01/13/2015
IHS identifies technologies transforming the world

Trends

The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology. “We know that technology has the capability to change the world: from the Gutenberg printing press to the steam
. . . Read More
Date:
01/12/2015
Randy Ryder of Freescale on wireless charging

Randy Ryder of Freescale

In this PSDcast Randy Ryder of Freescale talks to Alix Paultre of Power Systems Design about wireless power transmission and some of the issues involved. Currently the biggest opportunity lies in the charging of batteries in mobile devices, so issues range from multiple standards to energy densities of storage
. . . Read More
Date:
01/12/2015
Cornell Dubilier unveils 125°C hybrid polymer-aluminum electrolytic capacitors

HZC Hybrid Polymer-Aluminum electrolytic capacitors

Cornell Dubilier Electronics announced the release of type HZC Hybrid Polymer-Aluminum electrolytic capacitors. Rated for 125 °C, type HZC combines the advantages of aluminum electrolytic and aluminum polymer technology. These hybrid capacitors have the ultra-low ESR characteristics of conductive aluminum polymer
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Date:
01/09/2015
Dunstan Power of ByteSnap on harvested energy in the IoT

Dunstan Power of ByteSnap

In this PSDcast Dunstan Power, Director of ByteSnap Design, talks to Alix Paultre about embedded systems and the challenges the demand for functionality presents to the design community. Harvested and other  advanced energy storage and management technologies can directly impact the success or failure of
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Date:
01/08/2015
Linear's configurable buck converters deliver 8A from 2 to 4 independent outputs

LTC3371 highly-integrated general-purpose power management solution

Linear Technology announced the LTC3371, a highly-integrated general-purpose power management solution for systems requiring multiple low voltage power supplies. The device features four synchronous buck converters, each powered from independent 2.25V to 5.5V inputs, and each configurable to share up to four
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Date:
01/08/2015
Active-Semi announced the availability of Qi-compatible medium power (MP) wireless charging solutions based on PAC5220 Power Application Controller (PAC) IC for powering smart phones, mobile devices and tablets. This announcement comes as a follow-up to previously released Qi-certified A11 and A6 Wireless transmitter
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Date:
01/08/2015
AVX's latest AC film caps suppress Class X2 interference in power & RF apps

FV Series AC film capacitor

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the FV Series AC film capacitors. Designed to provide Class X2 interference suppression, FV Series metallized polypropylene film capacitors are rated for 305Vrms and exhibit self-healing properties, high moisture resistance,
. . . Read More
Date:
01/08/2015
HARTING expands Han-Modular connector family with highest-density module

The Han DD Quad module

The Han DD Quad module from HARTING is the highest-density module available in the company's Han-Modular industrial connector family. The new module incorporates space for 42 Han D contacts with crimp termination, allowing users to place around 25% more contacts in the same space. As a result, complete connector
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Date:
01/08/2015
Indium to showcase their latest lead-free solder paste at APEX

Indium10.1 is a Pb-free halogen-containing solder paste

Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of
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Date:
01/08/2015
Farsens releases MEDUSA development platform for battery-free wireless sensors and actuators

Medusa from Farsens is a development platform for UHF RFID battery-free devices

The Medusa from Farsens is a development platform for UHF RFID battery-free devices. The Medusa includes an ANDY100 chip with EPC C1G2 communication and a MSPG2233IPW20 microcontroller from Texas Instruments for communication with developers’ circuits. Users can now develop their own wireless sensors
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Date:
01/07/2015
Micrel launches small and efficient load switch for mobiles

The MIC95410 7A load switch

Micrel, an industry leader in high performance linear and power solutions, LAN and timing and communications solutions, introduced the MIC95410 7A load switch in a compact 1.2mm x 2.0mm package. This device can be used for systems requiring power partitioning and has the capability of a controlled power up sequence
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Date:
01/07/2015
Molex, a leading interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry.   “Together, Molex
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Date:
01/07/2015
Intel accelerates wearable tech

The Intel Curie module

Intel Corporation announced a number of technology advancements and initiatives aimed at accelerating computing into the next dimension. The announcements include the Intel Curie module, a button-sized hardware product for wearable solutions; applications for Intel RealSense cameras spanning robots, flying multi-copter
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Date:
01/07/2015
One year following Consumer Electronics Show (CES) 2014, the Alliance for Wireless Power (A4WP) announced it has doubled its membership and expanded the applicability of the Rezence technical specification to include wireless charging of cell phones and smartphones, tablets, notebooks, laptops and desktop PC
. . . Read More
Date:
01/07/2015
Scorpion power/signal connectors from Astute provide flexibility in hi-rel applications

Positronic’s Scorpion modular signal power connector

Astute Electronics, a leading supplier of electronic components and value added services, has announced the availability of Positronic’s Scorpion modular signal power connector family including the low profile version. Positronic uses modular tooling that enables the quick turnaround of a very large number
. . . Read More
Date:
01/07/2015
Cooler Master, a leading creator, innovator and manufacturer of desktop components and peripherals, and CoolChip Technologies, a leading fabless technology house of thermal management solutions, announced a partnership to bring kinetic cooling technology to the multi-billion dollar
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Date:
01/06/2015
Revenues for the consumer electronics (CE) industry are projected to grow three percent in 2015 and to reach an all-time high of $223.2 billion, according to The U.S. Consumer Electronics Sales and Forecasts, the semi-annual industry report released today by the Consumer Electronics Association (CEA). The total
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Date:
01/06/2015
Wearable technology: a materials goldmine

Percentage of cost of wearable technology attributable to electronically and electrically functional materials 2015-2025

In 2025 over $25 billion will be spent on formulations and intermediate materials for wearable technology, as forecast by analysts IDTechEx in the brand new report "Wearable Technology Materials 2015-2025". Companies at this early part of the value chain will enjoy a multiplier over the coming decade.
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Date:
01/06/2015
M/A-COM Technology Solutions (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, announced a comprehensive new portfolio of passive components for DOCSIS 3.1 compliant cable TV (CATV) and broadband Internet systems. This new product family, spanning upstream
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Date:
01/06/2015
Ideal Power, a developer of a disruptive power conversion technology, announced that the European Patent Office awarded the company a patent (EP2025051 B1) for its core power conversion technology, Power Packet Switching Architecture (PPSA). This patent, along with previously granted U.S. and Chinese patents,
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Date:
01/06/2015
Jeremy Rifkin, author of The Zero Marginal Cost Society, joined BK Yoon, President of Samsung Electronics, on stage during Mr. Yoon’s opening keynote address on the future of the Internet of Things at the 2015 International Consumer Electronics Show (CES) in Las Vegas. Mr. Rifkin described how the Internet
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Date:
01/06/2015
Christian KÃck von Linear Technology Ãber neu MÃglichkeiten und Bauelemente

Christian Kück von Linear Technology

In diesem PSDcast Christian Kück, Strategic Marketing Manager bei Linear Technology, spricht mit Alix Paultre der Power Systems Design über die aktuellen Herausforderungen in der elektronischen Design Industrie und die neuesten Komponenten und Dienste Linear Technology geschaffen hat um sie anzusprechen.
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Date:
01/05/2015
GreenPeak launches ZigBee chip and module for smart home and IoT

GreenPeak's integrated ZigBee Module for Smart Home and IoT networks

GreenPeak Technologies, the industry leading Smart Home semi-conductor/system company, launched the GP691 ZigBee communication controller chip and GPM6000 integrated ZigBee Modules for Smart Home and IoT networks and devices. The GP691 ZigBee communications controller provides IEEE Standard 802.15.4-compliant
. . . Read More
Date:
01/05/2015
Application developers registered with the Smart TV Alliance develop applications for 58 million smart TVs in a single, integrated process within the Smart TV Alliance Common Developer Portal. One-third of the world’s smart TVs are now compatible with the Smart TV Alliance development toolkit. The Common Developer
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Date:
01/05/2015
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