Consumer

April 2022

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Figure 1. Infineon StrongIRFET™ and OptiMOS™ power MOSFET 20-300 V technologies

Bring Your Design to the Next Level of Efficiency with OptiMOS™ 6 100 V Power MOSFET Technology

Francesca Pastorelli, Senior Specialist Product Management, Power Discretes, and Simone Mazzer, Senior Application Engineer, both at Infineon Technologies

Introducing a game changer for high switching frequency applications High efficiency, power density, and better thermal behavior are the key trends when it comes to power management. Infineon is constantly working on introducing highly innovative power MOSFET technologies able to meet the requirements for all app

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Date:

04/30/2022

2-in-1 Super Low Capacitance TVS for USB 4.0 & Thunderbolt 4.0 & HDMI2.1 Protection

Alpha and Omega Semiconductor Limited (AOS) announced the release of AOZ8S204BL2 and AOZ8S205BL2, 2-in-1 transient voltage suppressors (TVS) for super high-speed line protection using the latest Super Low Cap TVS platform and advanced packaging. These new devices are ideal for USB Type-C and HDMI applications su

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Date:

04/28/2022

Intelligent Power Modules Ensure Maximum Efficiency and Design Flexibility

Infineon Technologies AG adds a new member to the CIPOS Tiny Intelligent Power Module (IPM) family: the CIPOS Tiny IM323-L6G 600 V 15 A. The new IPM is based on TRENCHSTOP IGBT RC-D2 switches and state-of-the-art SOI gate driver technology to realize maximum efficiency and improved reliability, along wi

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Date:

04/25/2022

Pvilion CEO Colin Touhey

PSDcast – The Basics of Solar Clothing

One area of renewable energy we haven’t really covered, at least as of yet, is the wearable sort – including and especially solar clothing that generates power while you go about your daily routine. But it’s still a technology with a ton of potential, and here to discuss that is Pvilion CEO Colin Touhe

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Date:

04/19/2022

Carl Vondrick, assistant professor of computer science, Columbia University

Stopping "Them" From Spying on You

COLUMBIA UNIVERSITY SCHOOL OF ENGINEERING AND APPLIED SCIENCE

Ever noticed online ads following you that are eerily close to something you’ve recently talked about with your friends and family? Microphones are embedded into nearly everything today, from our phones, watches, and televisions to voice assistants, and they are always listening to you. Computers are constantly us

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Date:

04/18/2022

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Figure 1. Cross-section view of Infineon’s CoolGaN™ GIT device structure

Bringing WBG technology to the next level: Part 2 of 4 Editorial Series sponsored by infineon: Revolutionizing the next-gen power conversion applications

Eric Persson, Senior Principal Engineer, Infineon Technologies

Introduction Gallium Nitride (GaN) technology plays a major part in the wide bandgap revolution currently sweeping the semiconductor industry and manufacturers are racing to enter this burgeoning market. While the top-level advantages of using GaN devices in power electronics applications are clear (including higher switching frequencies, better performance at high temperatures, and lower power losses), the more subtle but nonetheless important differ

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Date:

04/14/2022

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Figure 1. Comparison of planar and trench MOSFET structure

Bringing WBG technology to the next level: Part 3 of 4 Editorial Series sponsored by Infineon: The fundamental game-changers for breakthrough SiC designs

Eva Gabriel, Senior Manager, Product Marketing SiC, Dr. Zhihui Yuan, Director, Technical Marketing SiC discretes, and Andre Lenze, Senior Staff Engineer, SiC low- and medium power modules, all at Infineon Technologies

Introduction Society’s demand for energy is continuously increasing. A plethora of digital content is consumed every day, appliances are connected via the cloud, and vehicle electrification is experiencing a renaissance – all of which are contributing to this energy demand upsurge. At the same time, carbon emis

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Date:

04/14/2022

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Figure 1. Suitability of Si, SiC, and GaN for power supply applications

Bringing WBG technology to the next level: Part 4 of 4 Editorial Series sponsored by Infineon: When to make the move from silicon to wide bandgap

Dr. Gerald Deboy, Distinguished Engineer, Infineon Technologies

Introduction Silicon power devices, such as MOSFETs and IGBTs, have a long history of reliable operation in power applications. They are low-cost, with a proven track record, and there’s a wide choice of suppliers so that designers can have a second source. They are also a familiar, well-established opti

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Date:

04/14/2022

VPC Hybrid Capacitors from VINATech Replace Batteries in Eco-Friendly Samsung TV Remote

VINATech Co. has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used in the new 2022 eco-friendly solar cell TV remote control for Samsung Electronics' recently-launched Neo QLED TV. This is the first time in the world that a hybrid capacitor has completely replaced the battery as the

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Date:

04/12/2022

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Figure 1. Examples for extrinsic defects in an amorphous layer, mathematically modeled via a local thinning effect in the gate-oxide of SiC devices

Bringing WBG technology to the next level: Part 1 of 4 Editorial Series sponsored by Infineon: Wide bandgap reliability is all about understanding how and why failures happen

Peter Friedrichs, Vice President SiC, and Tim McDonald, Senior Director, Consulting Advisor to the CoolGaN™ program, both at Infineon Technologies

Introduction The unique properties of Gallium Nitride (GaN) and Silicon Carbide (SiC) devices make them increasingly popular alternatives for silicon in power electronics applications. The appeal of SiC devices lies in their ability to offer unipolar device concepts with low switching losses at high voltages, while GaN devices can switch at much higher frequencies. Although these properties enable smaller

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Date:

04/08/2022

Infineon Rolls Power Management Solution for Intel XEON

Infineon Technologies AG announced the launch of a complete power management offering for compute servers based on Intel’s Sapphire Rapids compute processing units (CPU). This new “pick-and-place” solution utilizes several Infineon power management devices and technologies that deliver optimum po

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Date:

04/01/2022

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Figure 1. Typical B-H curve from positive saturation to negative saturation. When H is zero there exists Br which requires -Hc to return to zero. The area within the loop is core loss per cycle

AC Losses in Magnetic Components

By: George Slama, Würth Elektronik eiSos

What are AC Losses and why are they important? This paper discusses the physical effects and which issues must be observed by design engineers. Furthermore, an approach to determine AC losses with unmatched accuracy is being introduced. In 1892 Charles P. Steinmetz, working for General Electric presented his no

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Date:

04/01/2022

Researchers from MIT and elsewhere have created a framework that could enable a robot to effectively complete complex manipulation tasks with deformable objects, like dough or cloth, that require many tools and take a long time to complete.

Solving the Challenges of Robotic Pizza-Making

MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Imagine a pizza maker working with a ball of dough. She might use a spatula to lift the dough onto a cutting board then use a rolling pin to flatten it into a circle. Easy, right? Not if this pizza maker is a robot. For a robot, working with a deformable object like dough is tricky because the shape of dough

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Date:

04/01/2022