Data Centers

September 2025

Click image to enlarge

Figure 1: PSE (board in the picture below) and PD (board in the picture above) of the Reference Design RD041 during start-up

Electromagnetic Compatibility

Adrian Stirn / Editor: Gerhard Stelzer, Würth Elektronik eiSos

With just one twisted pair of wires, Single-Pair Ethernet is a convincingly lean solution. This cabling becomes even more efficient if it is also used for power supply in addition to data transmission - this is referred to as "Single-Pair with Power-over-Ethernet" (SPoE). What about electromagnetic compatibili

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Date:

09/30/2025

Tark Thermal Solutions’ MBX Series Micro Thermoelectric Coolers Empower Next-Gen Pluggables for AI Data Centers

Thermoelectric Coolers Empower Next-Gen Pluggables for AI Data Centers

Tark Thermal Solutions, the leading global manufacturer of thermal management solutions (formerly Laird Thermal Systems), introduces new custom options in the Series of OptoTEC™ MBX thermoelectric coolers (TECs), engineered to address emerging thermal challenges in ultra-high-speed optical transceivers fueling th

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Date:

09/29/2025

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Electronics Europe GmbH (“Toshiba”) announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and are designed to reduce switching losses in

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Date:

09/02/2025