Motor Drives, Robotics & Controls

March 2013
Allan Armstrong of XiTRON Technologies, precision power testing and measurement
. . . Learn More
Date:
03/27/2013
  Miguel Mendoza of Micrel explains a motor
. . . Learn More
Date:
03/26/2013
Configurable Module regulator array has five low-noise 1A devices for multirail logic apps
Housed in a 15mm x 15mm x 3.42mm ball grid array (BGA) package, the LTM8001 step-down μModule® (micromodule) regulator from Linear Technology consists of an array of five low noise 1A linear regulators.
. . . Learn More
Date:
03/22/2013
Ten-amp, 1200V Silicon Carbide Schottky Rectifier offers improved high-temperature performance
Central Semiconductor has released the CSIC10-1200 , 10 Amp, 1200 Volt silicon carbide Schottky rectifier designed for high frequency systems where energy efficiency and thermal performance are critical
. . . Learn More
Date:
03/22/2013
ON Semiconductor, driving innovation in energy efficiency, is showcasing its latest power efficient product advances at APEC 2013, March 17 - 21, 2013, in Long Beach, California. The new devices
. . . Learn More
Date:
03/20/2013
Ultracap modules address needs of automotive, wind, industrial and hybrid bus industries
Ioxus, a manufacturer of performance ultracapacitor technology for transportation, alternative energy, medical, industrial and consumer product markets, today unveiled three new modules: the iMODTM
. . . Learn More
Date:
03/20/2013
International Rectifier, a leader in power management technology, announced the enhancement of its Insulated Gate Bipolar Transistor (IGBT) selection tool that enables design optimization in a
. . . Learn More
Date:
03/15/2013
GaN-on-silicon power devices first to be JEDEC qualified
Transphorm announced the Total GaNTM family of GaN (Gallium Nitride)-on-silicon transistors and diodes, presenting it as the world's first JEDEC-qualified 600 V GaN device platform.
. . . Learn More
Date:
03/14/2013
Cree unveils second-generation 1200V SiC MOSFET
Cree announces the release of its second generation SiC MOSFET enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver
. . . Learn More
Date:
03/13/2013
The VBM-360 family of baseplate-cooled compact ac-dc power supplies from CUI offers a high power density of 14.8 W/in3, providing 355 W in an industry standard footprint. The space-saving power
. . . Learn More
Date:
03/08/2013
Fanless AC-DC power system delivers 1300 W of continuous power
Enabling system designers to forego fan and forced-air cooling in power systems, a conduction-cooled version of the Vicor high-efficiency Westcorâ„¢ MicroPACâ„¢ thermally-optimized, noise-free
. . . Learn More
Date:
03/07/2013
Vishay Intertechnology announced its technology lineup for the Applied Power Electronics Conference and Exposition (APEC) 2013, taking place March 17-21 in Long Beach, Calif. In booth 113, Hall
. . . Learn More
Date:
03/07/2013
Sixth-generation 600V IGBTs improve hard-switching efficiency
Now available from TTI, Toshiba's sixth generation IGBT technology offers improved switching loss/conduction loss trade off for increased efficiency and improved performance. This has been incorporated
. . . Learn More
Date:
03/06/2013
Intelligent Systems Source (ISS) will be hosting three conference tracks and a pavilion within the 2013 Sensors Expo in Chicago, Illinois during the two day conference from June 5-6. With over
. . . Learn More
Date:
03/06/2013
Gate drivers target IGBT and SiC FET designs
Texas Instruments introduced what is presented as the industry's first 35-V, single-channel, output stage power management gate drivers for insulated-gate bipolar transistors (IGBTs) and silicon carbide
. . . Learn More
Date:
03/01/2013
Vicor announced the expansion of its award-winning Picor Cool-Power® ZVS Buck Regulator product line for high efficiency point-of-load DC-DC regulation. Optimized for 12 V operation (8 V to 18 Vin),
. . . Learn More
Date:
03/01/2013
Current-sensing ICs offered in tiny package
Allegro's smallest current sensor linear IC, the ACS711, is now housed in a 0.75 mm thick low-profile QFN package measuring only 3 mm × 3 mm. This new micro-sized device is possibly the smallest
. . . Learn More
Date:
03/01/2013
Archives