Motor Drives, Robotics & Controls

    March 2013
    Allan Armstrong of XiTRON Technologies, precision power testing and measurement
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    Date:
    03/27/2013
      Miguel Mendoza of Micrel explains a motor
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    Date:
    03/26/2013
    Configurable Module regulator array has five low-noise 1A devices for multirail logic apps
    Housed in a 15mm x 15mm x 3.42mm ball grid array (BGA) package, the LTM8001 step-down μModule® (micromodule) regulator from Linear Technology consists of an array of five low noise 1A linear regulators.
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    Date:
    03/22/2013
    Ten-amp, 1200V Silicon Carbide Schottky Rectifier offers improved high-temperature performance
    Central Semiconductor has released the CSIC10-1200 , 10 Amp, 1200 Volt silicon carbide Schottky rectifier designed for high frequency systems where energy efficiency and thermal performance are critical
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    Date:
    03/22/2013
    ON Semiconductor, driving innovation in energy efficiency, is showcasing its latest power efficient product advances at APEC 2013, March 17 - 21, 2013, in Long Beach, California. The new devices
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    Date:
    03/20/2013
    Ultracap modules address needs of automotive, wind, industrial and hybrid bus industries
    Ioxus, a manufacturer of performance ultracapacitor technology for transportation, alternative energy, medical, industrial and consumer product markets, today unveiled three new modules: the iMODTM
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    Date:
    03/20/2013
    International Rectifier, a leader in power management technology, announced the enhancement of its Insulated Gate Bipolar Transistor (IGBT) selection tool that enables design optimization in a
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    Date:
    03/15/2013
    GaN-on-silicon power devices first to be JEDEC qualified
    Transphorm announced the Total GaNTM family of GaN (Gallium Nitride)-on-silicon transistors and diodes, presenting it as the world's first JEDEC-qualified 600 V GaN device platform.
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    Date:
    03/14/2013
    Cree unveils second-generation 1200V SiC MOSFET
    Cree announces the release of its second generation SiC MOSFET enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver
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    Date:
    03/13/2013
    The VBM-360 family of baseplate-cooled compact ac-dc power supplies from CUI offers a high power density of 14.8 W/in3, providing 355 W in an industry standard footprint. The space-saving power
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    Date:
    03/08/2013
    Fanless AC-DC power system delivers 1300 W of continuous power
    Enabling system designers to forego fan and forced-air cooling in power systems, a conduction-cooled version of the Vicor high-efficiency Westcorâ„¢ MicroPACâ„¢ thermally-optimized, noise-free
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    Date:
    03/07/2013
    Vishay Intertechnology announced its technology lineup for the Applied Power Electronics Conference and Exposition (APEC) 2013, taking place March 17-21 in Long Beach, Calif. In booth 113, Hall
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    Date:
    03/07/2013
    Sixth-generation 600V IGBTs improve hard-switching efficiency
    Now available from TTI, Toshiba's sixth generation IGBT technology offers improved switching loss/conduction loss trade off for increased efficiency and improved performance. This has been incorporated
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    Date:
    03/06/2013
    Intelligent Systems Source (ISS) will be hosting three conference tracks and a pavilion within the 2013 Sensors Expo in Chicago, Illinois during the two day conference from June 5-6. With over
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    Date:
    03/06/2013
    Gate drivers target IGBT and SiC FET designs
    Texas Instruments introduced what is presented as the industry's first 35-V, single-channel, output stage power management gate drivers for insulated-gate bipolar transistors (IGBTs) and silicon carbide
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    Date:
    03/01/2013
    Vicor announced the expansion of its award-winning Picor Cool-Power® ZVS Buck Regulator product line for high efficiency point-of-load DC-DC regulation. Optimized for 12 V operation (8 V to 18 Vin),
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    Date:
    03/01/2013
    Current-sensing ICs offered in tiny package
    Allegro's smallest current sensor linear IC, the ACS711, is now housed in a 0.75 mm thick low-profile QFN package measuring only 3 mm × 3 mm. This new micro-sized device is possibly the smallest
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    Date:
    03/01/2013
    Archive

    Power Systems Design

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    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.