Powering Embedded Systems

March 2018
Maxim's Himalaya uSLIC Solution, the Industry's Smallest Power Modules, Revolutionizes Design for Highly Space-Constrained Applications
Designers working on space-constrained applications can now dramatically reduce solution size and increase efficiency with the family of micro system-level IC ("uSLIC") modules from Maxim Integrated Products. The MAXM17532 and MAXM15462 ultra-small (2.6mm x 3.0mm x 1.5mm), integrated DC-DC power modules
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Date:
03/21/2018
Murata launches ultra-efficient 1/16th brick DC/DC converters for industrial and railway applications
Murata launches its latest in a series of encapsulated DC-DC converters designed specifically for industrial, industrial mobility and railway applications. The 50 watt IRS-Q48 series from Murata Power Solutions provides market-leading efficiency using the latest technology for fixed frequency switching power s
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Date:
03/21/2018
Toshiba launches 1.5A LDO regulators in ultra-small package
Toshiba Electronics Europe has started shipping a new low-dropout (LDO) regulator series in the industry’s smallest WCSP6F package measuring just 1.2mm x 0.8mm x 0.3mm. The TCR15AG series comprises of 47 different voltage options and is suitable for any mobile or modular application that requires a small, th
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Date:
03/21/2018
Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components, is Vishay’s new best in class 60V MOSFET SiR626DP. The product elevates DC/DC efficiency and performance across the load with minimum circuit rework. Peak efficiency is up to 15% higher than competition.
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Date:
03/21/2018
ROHM announces Industry's First Power Supply ICs for Hi-Fi Audio
ROHM has recently announced the availability of high-fidelity power supply ICs optimized for audio devices requiring high-resolution playback. The BD372xx series are the first audio power supply ICs to combine leading-edge analog and sound reproduction technologies. In addition to integrating a newly developed fas
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Date:
03/21/2018
MIPAQ Pro, the intelligent device for smart grids
Infineon Technologies has optimized its high power intelligent power module (IPM) MIPAQ Pro for the fields of energy storage and smart grid. Customers now profit from complete monitoring and easy scalability of the IPM. Additional features comprise of higher power density, true real time junction temperature det
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Date:
03/21/2018
New 200-watt development system: Combining wireless power and data transmission
Under the name 760308EMP-WPT-200W, Würth Elektronik eiSos and Infineon Technologies are offering a 200-watt development system for wireless power transfer. What makes the development kit special is that the link between the transmitter and receiver coils can be used to transfer not only power but also data.
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Date:
03/21/2018
Würth Elektronik eiSos joins STMicroelectronics Partner Program to one common goal: success for their customer!
Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, has joined the partner program of STMicroelectronics. The goal of the initiative set up by ST, a global semiconductor leader serving customers across the spectrum of electronics applications, is to speed customer development e
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Date:
03/21/2018
Toshiba releases N-channel MOSFET driver ICs
Toshiba Electronics Europe today announced the launch of two new N-channel MOSFET drivers suitable for rapid-charging and other high current applications. The new TCK401G (active-high) and TCK402G (active-low) charge pump driver ICs are suitable for high current mobile charging applications when used in conjun
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Date:
03/21/2018
Murata releases new 1W regulated SMT DC-DC converter
Murata has expanded its product range of embedded-core technology DC-DC converters with the NXF1 series, a cost effective, fully regulated, high isolation converter with 3.3 V or 5 V outputs from Murata Power Solutions. Inputs available are nominal 3.3 V and 5 V in an industry-standard surface-mount package wi
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Date:
03/21/2018
Power Industry Leaders Create Alliance for 48V Direct-Conversion Applications
San Jose, Calif. – At the Open Compute U.S. Summit 2018, four leading suppliers of power solutions announced a new alliance, the Power Stamp Alliance, to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules - or ‘power stamps’ -
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Date:
03/20/2018
New PS/2 ATX flagship presented: High-end Industrial PC Power Supply with 80PLUS® Platinum for latest mainboard generations
The Industrial PC Power Supply BEA-550K is the new flagship of worldwide used BEA power supply series from Bicker Elektronik, Donauwoerth/Germany. The highly efficient and very robust 500 Watt IPC power supply impresses with uncompromising quality and longevity. The BEA-550K is ideally suited for use in harsh i
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Date:
03/07/2018
Power Integrations announced the release of its InnoSwitch3-Pro family of configurable off-line CV/CC and CP flyback switcher ICs. Capable of delivering up to 65 W and achieving up to 94% efficiency across line and load conditions, the new devices permit precise, dynamically adjustable, control of voltage (10 mV
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Date:
03/07/2018
Toshiba Launches High Peak Pulse Current TVS Diodes for Power Line Protection
Toshiba Electronics Europe has announced a new series of TVS diodes that protect USB power lines and power supply connectors used in mobile devices. Toshiba’s DF2SxxP2 series protects the power lines of smartphones and tablets by suppressing malfunctions and damage from ESD, noise from induced lightning that enters
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Date:
03/07/2018
KEMET Introduces KONNEKT Technology Enabling Higher Power Densities in Smaller Form Factors
KEMET announced new patented KONNEKT technology enabling high power density by combining multiple components into a single surface mountable package. This technology is designed for use by power electronics engineers where high-power density in a small form factor is critical. Developed in partnership with p
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Date:
03/07/2018
NextPower 100V power MOSFETs from Nexperia feature low Qrr, and high 175°C rating
Nexperia announced its NextPower 100 V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package. NextPower 100 V MOSFETs are Nexperia’s latest generation parts recommended for high efficiency switching and high
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Date:
03/07/2018
Wolfspeed’s High-Efficiency GaN HEMTs for RF Power Amps Now Shipping from Mouser Electronics
Mouser Electronics is now stocking the CG2H40xx and CG2H30070 gallium-nitride (GaN) high-electron-mobility transistors (HEMTs) from Wolfspeed™, a Cree® company. Operating from a 28-volt rail, the two HEMTs offer a versatile, general-purpose broadband solution for a variety of radio frequency (RF) and microw
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Date:
03/07/2018
Infineon Technologies and SAIC Motor establish power module joint venture SIAPM in China to power the largest market for electric vehicles in the world
SAIC Motor Corporation Limited and Infineon Technologies AG today announced the establishment of a joint venture to manufacture power modules for the dynamically developing electric vehicle market in China. SAIC Motor holds a stake of 51 percent of the JV and Infineon 49 percent, respectively. The partners have rece
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Date:
03/07/2018
ON Semiconductor’s SiC diodes offer higher efficiency, power density and lower system costs
ON Semiconductor has extended its SiC diode portfolio by introducing its newest family of 650 V silicon carbide (SiC) Schottky diodes. The diodes’ cutting edge, silicon carbide technology provides higher switching capabilities with lower power losses and effortless paralleling of devices. ON Semiconductor’s
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Date:
03/07/2018