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Power Passives and Discretes

 




 

 

Power Passives and Discretes

May 2015
Today’s power conversion and power management applications demand compact yet robust power switching circuitry that supports high-voltage, high-frequency operation with the minimum of losses from the smallest possible PCB area. By definition, the choice of MOSFET technology has a significant impact
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Date:
05/29/2015
Designing the future

Alix Paultre, Editorial Director, PSD

The first modern wave of rapid human development, also known as the first industrial revolution, began in the middle of the 18th century. The development of devices that could be used to magnify a human’s capabilities immediately changed the face of the planet, impacting everything from agriculture
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Date:
05/29/2015
A niche market only a few years ago, the solar photovoltaic (PV) industry is now becoming a mainstream electricity provider, and changing the way the world is powered. Following a difficult period of industry consolidation and economic crisis, PV installations saw another record year in 2013, with more than
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Date:
05/29/2015

Eaton's automotive-grade Coiltronics HCMA Series high-current power inductors enhances system reliability

Coiltronics HCMA Series high-current power inductors

Power management company Eaton announced the launch of its automotive grade Coiltronics HCMA Series of high-current power inductors to meet and exceed the Automotive Electronics Council’s (AEC) Q200 Grade 3 standard with a maximum total temperature operation range from minus 55ºC to 125ºC. The inductors
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Date:
05/29/2015
System architects of embedded systems, networking, and datacom equipment are constantly being pushed to increase the data throughput and performance of their systems as well as add functionality and features. At the same time, pressure is being applied to decrease the system’s overall power consumption. For
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Date:
05/28/2015
Did you know that every 10°C rise in ambient temperature reduces every component’s lifetime by 50%? That power supplies with drop-offs or variances can lead to premature failures and even completely fried parts in your system? Indeed, most agree that power-intensive applications need, and really must have,
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Date:
05/28/2015
We thought it would be helpful to assemble a top five list of the most common mistakes or “don’ts” that occur during the design of efficient power systems – and how to avoid them. This information comes from our observations and yes, some of our own experiences during Electrocube’s 50-plus years in
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Date:
05/28/2015
As power levels are increased and output voltages drop, it is common to have just a few turns in the windings of inductors and transformers. When this happens, standard round wires are usually not the best choice for building magnetic structures, and foil is often used. With a foil winding, the width of the
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Date:
05/28/2015
Towards a new era in power electronics

Jim Witham, CEO, GaN Systems

GaN material offers orders of magnitude improvement in switching and conduction performance and, when produced on GaN-on-Silicon substrates, can reduce power system costs.  Only diamond power semiconductors have been proposed as a superior material system to GaN, but the consensus is that we are decades
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Date:
05/28/2015
EPC unveils 7mâ„ 200V, and 5mâ„ 150V GaN power transistors

EPC eGaN FET

Efficient Power Conversion Corporation (EPC) announced the introduction of two eGaN FETs that raise the bar for power conversion performance. These products have a maximum operating temperature of 150°C and pulsed currents capabilities of 200 A (150 V EPC2034) and 140 A (EPC2033). Applications include DC-DC
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Date:
05/28/2015
In this episode of PSDtv GaN Systems goes over their latest wide-bandgap power solutions and packaging for Power Systems Design at PCIM 2015. In addition to their new top-cooling
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Date:
05/27/2015
Cree claims industry’s first 900V SiC MOSFET

SiC 900V MOSFETs

Cree, a leader in silicon carbide (SiC) power products, has introduced its latest breakthrough in SiC power device technology: the industry’s first 900V MOSFET platform. Optimized for high frequency power electronics applications, including renewable energy inverters, electric vehicle charging systems, and
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Date:
05/26/2015
Panasonic Automotive & Industrial Systems POSCAP TC series polymer capacitors withstand high temperatures range, have a low ESR and a high resistance to stress suiting them to industrial and other applications that require a life of 10 years. The wide operating temperature range of -55 to +125degC ensures
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Date:
05/26/2015
ROHM claims first trench-type SiC MOSFET

SiC MOSFET featuring a trench structure

ROHM announced the first development and mass production of an SiC MOSFET that adopts the trench structure. Compared to existing planar-type SiC MOSFETs, ON resistance is reduced by 50% in the same chip size, making it possible to significantly decrease power loss in a variety of equipment, from industrial inverters
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Date:
05/21/2015
GaN Systems, a leading developer of gallium nitride power switching semiconductors, launched the latest addition to its range of E-mode GaN-on-Silicon high power transistors based on its three core proprietary technologies. The new GaN high-power enhancement-mode device, designated the GS65516T, boasts the highest
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Date:
05/19/2015
Fairchild slashes IGBT energy losses to boost efficiency in industrial and automotive

4th generation 650V and 1200V IGBT device

Fairchild, a leading global supplier of high-performance semiconductor solutions, is slashing energy loss by 30 percent for its 4th generation 650V and 1200V IGBT devices. Using a novel design approach tailored for high- and medium-speed switching applications in industrial and automotive markets, Fairchild
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Date:
05/19/2015
GeneSiC unveils co-packaged SiC transistor-diodes

SiC Junction Transistor-Diodes

GeneSiC Semiconductor, a leader in Silicon Carbide (SiC) power semiconductors, announced the immediate availability of 20 mΩ-1200 V SiC Junction Transistor-Diodes in an isolated, 4-Leaded mini-module packaging that enables extremely low Turn-On energies losses while offering flexible, modular designs in high
. . . Read More
Date:
05/14/2015
Girvan Patterson of GaN Systems on GaN's

Girvan Patterson of GaN Systems

In this PSDcast friend of the show Girvan Patterson of GaN Systems talks to Alix Paultre of Power Systems Design about the recent announcements and advancements that has the industry finally recognizing that GaN has "arrived" in the marketplace as a viable hi-performance cost-effective
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Date:
05/14/2015
Standex-Meder Electronics, a manufacturer of precise, reliable, and long-lasting electronic and magnetic components is exhibiting at PCIM Europe and Sensor & Test Show in Nuremberg/Germany from May 19th to the 21st in Nuremberg, Germany. PCIM Europe is an international leading meeting point for specialists
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Date:
05/14/2015
The Cores and Components division of VACUUMSCHMELZE (VAC) will again attend PCIM in Nuremberg this year. From 19th to 21st May, VAC's stand 119 in Hall 7 will focus its product presentations on transformers, cut cores and chokes using the nanocrystalline material VITROPERM®. This year, VAC will highlight
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Date:
05/08/2015

 



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